Abstract: A memory device having a memory array with a plurality of memory cells electrically coupled to a plurality of wordlines and a plurality of bitlines and control logic coupled with the memory array. The control logic perform operations including: determining a metadata value characterizing a first read level voltage of a highest threshold voltage distribution of a subset of the plurality of memory cells, wherein the metadata value comprises at least one of a failed byte count or a failed bit count; adjusting, based on the metadata value, a second read level voltage for a second-highest threshold voltage distribution of the subset of the plurality of memory cells; and causing, to perform an initial calibrated read of the subset of the plurality of memory cells, the adjusted second read level voltage to be applied to a wordline of the plurality of wordlines to read the second-highest threshold voltage distribution.

Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a first memory block including first word lines for respective first memory cells of the first memory block; a second memory block including second word lines for respective second memory cells of the second memory block; first diffusion regions coupled to the first word lines; second diffusion regions adjacent the first diffusion regions, the second diffusion regions coupled to the second word lines; and a circuit to apply a voltage to the second diffusion regions in a write operation performed on the first memory block.

Abstract: A data latch circuit includes a first n-channel transistor and a first p-channel transistor. A gate of the first n-channel transistor and a gate of the first p-channel transistor are a common gate.

Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a first memory block including first control gates for respective first memory cells of the first memory block; a second memory block including second control gates for respective second memory cells of the second memory block; first diffusion regions coupled to the first control gates; second diffusion regions adjacent the first diffusion regions, the second diffusion regions coupled to the second control gates; and a circuit to apply a voltage to the second diffusion regions in a write operation performed on the first memory block.

Abstract: According to one embodiment, a semiconductor memory includes: a first bit line; a first select transistor having a first terminal connected to the first bit line; a first memory cell connected to a second terminal of the first select transistor; a circuit connected to the first bit line and applying an erase voltage to be applied to the first memory cell to the bit line via the first terminal and the second terminal; and a diode connected to the first bit line and the first circuit.

Abstract: A semiconductor memory device includes wirings arranged in parallel along a first direction, the wirings including first and second wirings that are adjacent and a third wiring adjacent to the second wiring, a first pillar between the first and second wirings and a second pillar between the second and third wirings, the first and second pillars each extending in a second direction crossing the first direction toward the semiconductor substrate, and first and second bit lines connected to the first and second pillars, respectively. A first voltage is applied to the second wiring during a program operation on a first memory cell at an intersection of the second wiring and the first pillar, and a second voltage higher than the first voltage is applied to the second wiring during a program operation on a second memory cell at an intersection of the second wiring and the second pillar.

Abstract: A data latch circuit includes a first n-channel transistor and a first p-channel transistor. A gate of the first n-channel transistor and a gate of the first p-channel transistor are a common gate.

Abstract: According to one embodiment, a semiconductor memory includes: a first bit line; a first select transistor having a first terminal connected to the first bit line; a first memory cell connected to a second terminal of the first select transistor; a circuit connected to the first bit line and applying an erase voltage to be applied to the first memory cell to the bit line via the first terminal and the second terminal; and a diode connected to the first bit line and the first circuit.

Abstract: A semiconductor memory device includes wirings arranged in parallel along a first direction, the wirings including first and second wirings that are adjacent and a third wiring adjacent to the second wiring, a first pillar between the first and second wirings and a second pillar between the second and third wirings, the first and second pillars each extending in a second direction crossing the first direction toward the semiconductor substrate, and first and second bit lines connected to the first and second pillars, respectively. A first voltage is applied to the second wiring during a program operation on a first memory cell at an intersection of the second wiring and the first pillar, and a second voltage higher than the first voltage is applied to the second wiring during a program operation on a second memory cell at an intersection of the second wiring and the second pillar.

Abstract: A data latch circuit includes a first n-channel transistor and a first p-channel transistor. A gate of the first n-channel transistor and a gate of the first p-channel transistor are a common gate.

Abstract: According to one embodiment, a semiconductor memory includes: a first bit line; a first select transistor having a first terminal connected to the first bit line; a first memory cell connected to a second terminal of the first select transistor; a circuit connected to the first bit line and applying an erase voltage to be applied to the first memory cell to the bit line via the first terminal and the second terminal; and a diode connected to the first bit line and the first circuit.

Abstract: A semiconductor memory device includes wirings arranged in parallel along a first direction, the wirings including first and second wirings that are adjacent and a third wiring adjacent to the second wiring, a first pillar between the first and second wirings and a second pillar between the second and third wirings, the first and second pillars each extending in a second direction crossing the first direction toward the semiconductor substrate, and first and second bit lines connected to the first and second pillars, respectively. A first voltage is applied to the second wiring during a program operation on a first memory cell at an intersection of the second wiring and the first pillar, and a second voltage higher than the first voltage is applied to the second wiring during a program operation on a second memory cell at an intersection of the second wiring and the second pillar.

Abstract: A semiconductor memory device includes first and second memory transistors and first and second word lines connected to gate electrodes of the memory transistors. The semiconductor memory device is configured such that a first write operation to the first memory transistor, a second write operation to the second memory transistor, a third write operation to the first memory transistor, and a fourth write operation to the second memory transistor are executed in this order. In the first and second write operations, data write is performed using only a program operation. In the third and fourth write operations, data write is performed using the program operation and the verify operation.

Abstract: A semiconductor memory device includes first and second memory transistors and first and second word lines connected to gate electrodes of the memory transistors. The semiconductor memory device is configured such that a first write operation to the first memory transistor, a second write operation to the second memory transistor, a third write operation to the first memory transistor, and a fourth write operation to the second memory transistor are executed in this order. In the first and second write operations, data write is performed using only a program operation. In the third and fourth write operations, data write is performed using the program operation and the verify operation.

Abstract: According to one embodiment, a semiconductor memory includes: a first bit line; a first select transistor having a first terminal connected to the first bit line; a first memory cell connected to a second terminal of the first select transistor; a circuit connected to the first bit line and applying an erase voltage to be applied to the first memory cell to the bit line via the first terminal and the second terminal; and a diode connected to the first bit line and the first circuit.

Abstract: A data latch circuit includes a first n-channel transistor and a first p-channel transistor. A gate of the first n-channel transistor and a gate of the first p-channel transistor are a common gate.

Abstract: A semiconductor memory device includes a first memory cell transistor, a second memory cell transistor, and a third memory cell transistor that are connected in series. A word line is coupled to a gate of the third memory cell transistor. A controller is configured to set a first upper limit value for voltages applied to the word line during writing of data to the first memory cell transistor and a second upper limit value for voltages applied to the word line during writing of data to the second memory cell transistor. The second upper limit value is different from the first upper limit value.

Abstract: A semiconductor memory device includes wirings arranged in parallel along a first direction, the wirings including first and second wirings that are adjacent and a third wiring adjacent to the second wiring, a first pillar between the first and second wirings and a second pillar between the second and third wirings, the first and second pillars each extending in a second direction crossing the first direction toward the semiconductor substrate, and first and second bit lines connected to the first and second pillars, respectively. A first voltage is applied to the second wiring during a program operation on a first memory cell at an intersection of the second wiring and the first pillar, and a second voltage higher than the first voltage is applied to the second wiring during a program operation on a second memory cell at an intersection of the second wiring and the second pillar.

Abstract: According to one embodiment, a semiconductor memory device includes first and second memory cells, a word line, first and second bit lines, a sense amplifier and a driver. The first and second memory cells have first and second threshold voltages, respectively. The word line is electrically connected to the first and second memory cells. The first and second bit lines are electrically connected to the first and second memory cells, respectively. The driver increases gradually the voltage of the word line. When the voltage of the word line is increased gradually by the driver, the sense amplifier senses the first and second threshold voltages in ascending order.

Abstract: A semiconductor memory device includes wirings arranged in parallel along a first direction, the wirings including first and second wirings that are adjacent and a third wiring adjacent to the second wiring, a first pillar between the first and second wirings and a second pillar between the second and third wirings, the first and second pillars each extending in a second direction crossing the first direction toward the semiconductor substrate, and first and second bit lines connected to the first and second pillars, respectively. A first voltage is applied to the second wiring during a program operation on a first memory cell at an intersection of the second wiring and the first pillar, and a second voltage higher than the first voltage is applied to the second wiring during a program operation on a second memory cell at an intersection of the second wiring and the second pillar.