Abstract: A heather unit including a small diameter sheath heater with improved reliability is provided. The heater unit includes a first substrate having a first joint surface and a second substrate having a second joint surface being joined together, a groove arranged on at least one of the first joint surface or the second joint surface, and a sheath heater arranged inside the groove. The sheath heater includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a space within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the space, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.

Abstract: A small diameter sheath heater with improved reliability is provided. The sheath heater according to one embodiment of the present invention includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a gap within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the gap, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.

Abstract: A substrate supporting unit is provided. The substrate supporting unit possesses a shaft, a first heater, and a stage. The first heater is located in the shaft and is configured to heat an upper portion of the shaft. The stage is located over the shaft and includes a first plate, a second plate over the first plate, and a second heater between the first plate and the second plate.

Abstract: A member for a plasma processing device includes: an aluminum base material; and an oxide film formed on the aluminum base material and having a porous structure, the oxide film including a first oxide film formed on a surface of the aluminum base material, a second oxide film formed on the first oxide film, and a third oxide film formed on the second oxide film, wherein the first oxide film is harder than the second oxide film and the third oxide film, and a hole formed in each of the first oxide film, the second oxide film and the third oxide film is sealed.

Abstract: A small diameter sheath heater with improved reliability is provided. The sheath heater according to one embodiment of the present invention includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a gap within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the gap, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.

Abstract: A heather unit including a small diameter sheath heater with improved reliability is provided. The heater unit includes a first substrate having a first joint surface and a second substrate having a second joint surface being joined together, a groove arranged on at least one of the first joint surface or the second joint surface, and a sheath heater arranged inside the groove. The sheath heater includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a space within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the space, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.

Abstract: A substrate supporting unit is provided. The substrate supporting unit possesses a shaft, a first heater, and a stage. The first heater is located in the shaft and is configured to heat an upper portion of the shaft. The stage is located over the shaft and includes a first plate, a second plate over the first plate, and a second heater between the first plate and the second plate.

Abstract: Provided is a stage for precisely controlling a substrate temperature and a manufacturing method thereof. Alternatively, a film-forming apparatus or a film-processing apparatus having the stage is provided. The stage includes a base material and a heater layer over the base material. The heater layer has a first insulating film, a heater wire over the first insulating film, and a second insulating film over the heater wire. The heater wire includes more than one kind of metal selected from tungsten, nickel. chromium cobalt, and molybdenum.

Abstract: A substrate support device formed of a metal and having a high withstand voltage and a high thermal resistance is provided. A substrate support device according to the present invention includes a plate section formed of a metal; a shaft section connected to the plate section and formed of a metal; a heating element provided in the plate section; and an insulating film formed on a first surface of the plate section, the first surface opposite to the shaft section, by ceramic thermal spraying. The substrate support device may further include an insulating film formed on a second surface of the plate section which intersects the first surface of the plate section approximately perpendicularly.