Patents by Inventor Goetz E. Leonhardt

Goetz E. Leonhardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7069527
    Abstract: A method to convert a wire layout geometry to a filament topology for determination of chip resistance is provided. The method includes resolving overlap of layout segments of the wire layout geometry and inserting a vertical filament into each of the layout segments. The method further includes connecting vertical filaments using lateral connections and merging connected parallel filaments. The method also includes removing open filaments and modifying the filament structure in a bend region based on relative dimensions of the vertical filaments within the bend region.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: June 27, 2006
    Assignee: Sun Microsystems, Inc.
    Inventor: Goetz E. Leonhardt