Patents by Inventor Goeun BAE

Goeun BAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating semiconductor device having contact structures
    Patent number: 9543202
    Abstract: Provided is a method of fabricating a semiconductor device, the method including forming interconnection structures extending parallel to each other on a substrate; performing a coating process and forming a liquid state silicon source material layer filling an area between the interconnection structures; performing a first annealing process, curing the liquid state silicon source material layer, and forming an amorphous silicon layer; and crystallizing the amorphous silicon layer and forming contact plugs.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: January 10, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jamin Koo, Youngseok Kim, Kongsoo Lee, Goeun Bae
  • METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING CONTACT STRUCTURES
    Publication number: 20160365279
    Abstract: Provided is a method of fabricating a semiconductor device, the method including forming interconnection structures extending parallel to each other on a substrate; performing a coating process and forming a liquid state silicon source material layer filling an area between the interconnection structures; performing a first annealing process, curing the liquid state silicon source material layer, and forming an amorphous silicon layer; and crystallizing the amorphous silicon layer and forming contact plugs.
    Type: Application
    Filed: March 4, 2016
    Publication date: December 15, 2016
    Inventors: Jamin KOO, Youngseok KIM, Kongsoo LEE, Goeun BAE