Patents by Inventor Goh Iwamoto

Goh Iwamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10233125
    Abstract: To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 ?m and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: March 19, 2019
    Assignee: DENKA COMPANY LIMITED
    Inventors: Daisuke Goto, Hideki Hirotsuru, Yoshitaka Taniguchi, Goh Iwamoto, Kazunori Koyanagi
  • Publication number: 20170107158
    Abstract: To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 ?m and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.
    Type: Application
    Filed: March 18, 2015
    Publication date: April 20, 2017
    Applicant: DENKA COMPANY LIMITED
    Inventors: Daisuke GOTO, Hideki HIROTSURU, Yoshitaka TANIGUCHI, Goh IWAMOTO, Kazunori KOYANAGI
  • Patent number: 8025962
    Abstract: An aluminum-silicon carbide composite suitable for a base plate for power module, having an aluminum-silicon carbide composite, with a front and a rear surface plane, that is a flat plate-shaped silicon carbide porous body impregnated with a metal mainly containing aluminum, and an aluminum layer made of a metal mainly containing aluminum formed only on the front surface plane, wherein the rear surface plane of the composite is exposed to the outside, and the shape of the exposed aluminum-silicon carbide composite is rectangular, optionally having peripheral portions encompassing holes removed. Plating is imparted to the composite by providing an aluminum layer on the rear surface plane. Flatness of the composite is improved by grinding its rear surface so that the composite is exposed to the outside. Warpage after grinding the rear surface, is controlled by controlling the thickness of the aluminum layer.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: September 27, 2011
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Goh Iwamoto, Hideo Tsukamoto, Akira Miyai, Yoshio Sasaki
  • Patent number: 7993728
    Abstract: A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 ?m in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies, wherein the aluminum layers each has an average thickness of from 10 to 150 ?m, the difference between the maximum thickness and the minimum thickness of the aluminum layer in each principal plane is at most 80 ?m, and the difference between average thicknesses of the aluminum layers on the respective pr
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: August 9, 2011
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Goh Iwamoto, Hideo Tsukamoto, Satoshi Higuma, Nobuyuki Hashimoto
  • Patent number: 7838107
    Abstract: An aluminum/silicon carbide composite prepared by infiltrating a flat silicon carbide porous body with a metal containing aluminum as the main component, including an aluminum alloy layer made of a metal containing aluminum as the main component on both principal planes, and one principal plane is bonded to a circuit plate and the other principal plane is utilized as a radiation plane. The silicon carbide porous body is formed or machined into a convexly bowed shape, and after infiltration with the metal containing aluminum as the main component, the aluminum alloy layer on the radiation plane is further machined to form the bow shape. The aluminum/silicon carbide composite is suitable as a base plate for a ceramic circuit plate on which semiconductor components are mounted, for which high reliability is required.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: November 23, 2010
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Goh Iwamoto, Hideki Hirotsuru, Kazunori Hirahara
  • Publication number: 20090280351
    Abstract: An aluminum-silicon carbide composite suitable for a base plate for power module is provided. A base plate for power module, comprising an aluminum-silicon carbide composite that is a flat plate-shaped silicon carbide porous body impregnated with a metal containing aluminum as the main component, and an aluminum layer made of a metal containing aluminum as the main component formed only on one of the principal planes of the composite, wherein a rear surface being the other one of principal planes of the aluminum-silicon carbide composite is exposed to the outside, and the shape of the exposed aluminum-silicon carbide composite is a rectangle or a rectangle from which portions encompassing holes in the peripheral portion are removed.
    Type: Application
    Filed: November 13, 2006
    Publication date: November 12, 2009
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Goh Iwamoto, Hideo Tsukamoto, Akira Miyai, Yoshio Sasaki
  • Publication number: 20090092793
    Abstract: A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 ?m in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies, wherein the aluminum layers each has an average thickness of from 10 to 150 ?m, the difference between the maximum thickness and the minimum thickness of the aluminum layer in each principal plane is at most 80 ?m, and the difference between average thicknesses of the aluminum layers on the respective pr
    Type: Application
    Filed: April 23, 2007
    Publication date: April 9, 2009
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Goh Iwamoto, Hideo Tsukamoto, Satoshi Higuma, Nobuyuki Hashimoto
  • Publication number: 20090075056
    Abstract: An aluminum-silicon carbide composite suitable as e.g. a base plate for power module is provided. An aluminum-silicon carbide composite comprising a flat plate-shaped silicon carbide porous body infiltrated with a metal containing aluminum as the main component, aluminum layers made of a material containing aluminum as the main component formed on both principal planes of the porous body, wherein the aluminum-silicon carbide composite has side faces formed by abrasive jet fabrication and the side faces do not have the aluminum layers made of a metal containing aluminum as the main component.
    Type: Application
    Filed: May 8, 2007
    Publication date: March 19, 2009
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Goh Iwamoto, Hideki Hirotsuru
  • Publication number: 20070248829
    Abstract: An aluminum/silicon carbide composite prepared by infiltrating a flat silicon carbide porous body with a metal containing aluminum as the main component, including an aluminum alloy layer made of a metal containing aluminum as the main component on both principal planes, and one principal plane is bonded to a circuit plate and the other principal plane is utilized as a radiation plane. The silicon carbide porous body is formed or machined into a convexly bowed shape, and after infiltration with the metal containing aluminum as the main component, the aluminum alloy layer on the radiation plane is further machined to form the bow shape. The aluminum/silicon carbide composite is suitable as a base plate for a ceramic circuit plate on which semiconductor components are mounted, for which high reliability is required.
    Type: Application
    Filed: September 7, 2005
    Publication date: October 25, 2007
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Goh Iwamoto, Hideki Hirotsuru, Kazunori Hirahara