Patents by Inventor Goh Kok SING

Goh Kok SING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9658248
    Abstract: A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: May 23, 2017
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Foong Wei Kuong, Goh Kok Sing, Shamal Mundiyath
  • Patent number: 9182424
    Abstract: A chip testing solution having two separate contacts: one to provide current and one to measure voltage. One contact acts as the force and other as sense, and with its unique short wipe stroke technology enables the electrical connection from the contact terminal of the device under test (DUT) to the loadboard without fail even after prolonged insertion/testing of the devices. The two contacts are in close proximity, but electrically isolated from each other. Each contact is made to electrically touch a single conductive lead/pad on the DUT thus forming a test connection. The two contacts; one on front and other on back, wiping on the lead/pads will generally be a “sense” probe, and a “force” used for making a Kelvin connection. The short contact is connected to the loadboard by means of an additional contact known as “interposer” extending through and top of the tall contact base body.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: November 10, 2015
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Foong Wei Kuong, Goh Kok Sing, Shamal Mundiyath, Muhamad Izzat Bin Roslee
  • Publication number: 20140103952
    Abstract: A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material.
    Type: Application
    Filed: March 21, 2013
    Publication date: April 17, 2014
    Applicant: JF Microtechnology Sdn. Bhd.
    Inventors: Foong Wei KUONG, Goh Kok SING, Shamal MUNDIYATH
  • Publication number: 20130249583
    Abstract: A chip testing solution having two separate contacts: one to provide current and one to measure voltage. One contact acts as the force and other as sense, and with its unique short wipe stroke technology enables the electrical connection from the contact terminal of the device under test (DUT) to the loadboard without fail even after prolonged insertion/testing of the devices. The two contacts are in close proximity, but electrically isolated from each other. Each contact is made to electrically touch a single conductive lead/pad on the DUT thus forming a test connection. The two contacts; one on front and other on back, wiping on the lead/pads will generally be a “sense” probe, and a “force” used for making a Kelvin connection. The short contact is connected to the loadboard by means of an additional contact known as “interposer” extending through and top of the tall contact base body.
    Type: Application
    Filed: March 19, 2013
    Publication date: September 26, 2013
    Applicant: JF Microtechnology Sdn. Bhd.
    Inventors: Foong Wei KUONG, Goh Kok SING, Shamal MUNDIYATH, Muhamad Izzat BIN ROSLEE