Abstract: The present invention is a plasma etching method that is implemented under plasma conditions using a process gas, wherein at least one gas selected from a hydrofluoroether represented by a formula (I) is used as the process gas, wherein R represents a hydrogen atom or a fluoroalkyl group represented by CnF2n+1, and m and n represent integers that satisfy 1?m?3 and 3?(m+n)?4. This plasma etching method can implement high etching selectivity with respect to silicon nitride, silicon, and an organic material while achieving a sufficiently high etching rate without using oxygen and hydrogen when etching silicon oxide.

Abstract: Pretreatment of an etch chamber for performing a silicon etch process and Bosch process can be effected by running a deposition process employing C5HF7, or by running an alternating deposition and etch process employing C5H2F6 and SF6. It has been discovered that the pretreatment of the etch chamber for the silicon etch process can enhance the etch rate of silicon by at least 50% without adverse effect on etch profile during a first each process following the pretreatment, while the etch rate enhancement factor decreases over time. By periodically performing the pretreatment in the etch chamber, the throughput of the etch chamber can be increased without adversely impacting the etch profile of the processed substrates.

Abstract: Pretreatment of an etch chamber for performing a silicon etch process and Bosch process can be effected by running a deposition process employing C5HF7, or by running an alternating deposition and etch process employing C5H2F6 and SF6. It has been discovered that the pretreatment of the etch chamber for the silicon etch process can enhance the etch rate of silicon by at least 50% without adverse effect on etch profile during a first each process following the pretreatment, while the etch rate enhancement factor decreases over time. By periodically performing the pretreatment in the etch chamber, the throughput of the etch chamber can be increased without adversely impacting the etch profile of the processed substrates.

Abstract: A hydrofluorocarbon gas is employed as a polymer deposition gas in an anisotropic etch process employing an alternation of an etchant gas and the polymer deposition gas to etch a deep trench in a semiconductor substrate. The hydrofluorocarbon gas can generate a thick carbon-rich and hydrogen-containing polymer on sidewalls of a trench at a thickness on par with the thickness of the polymer on a top surface of the semiconductor substrate. The thick carbon-rich and hydrogen-containing polymer protects sidewalls of a trench, thereby minimizing an undercut below a hard mask without degradation of the overall rate. In some embodiments, an improvement in the overall etch rate can be achieved.

Abstract: A hydrofluorocarbon gas is employed as a polymer deposition gas in an anisotropic etch process employing an alternation of an etchant gas and the polymer deposition gas to etch a deep trench in a semiconductor substrate. The hydrofluorocarbon gas can generate a thick carbon-rich and hydrogen-containing polymer on sidewalls of a trench at a thickness on par with the thickness of the polymer on a top surface of the semiconductor substrate. The thick carbon-rich and hydrogen-containing polymer protects sidewalls of a trench, thereby minimizing an undercut below a hard mask without degradation of the overall rate. In some embodiments, an improvement in the overall etch rate can be achieved.

Abstract: A hydrofluorocarbon gas is employed as a polymer deposition gas in an anisotropic etch process employing an alternation of an etchant gas and the polymer deposition gas to etch a deep trench in a semiconductor substrate. The hydrofluorocarbon gas can generate a thick carbon-rich and hydrogen-containing polymer on sidewalls of a trench at a thickness on par with the thickness of the polymer on a top surface of the semiconductor substrate. The thick carbon-rich and hydrogen-containing polymer protects sidewalls of a trench, thereby minimizing an undercut below a hard mask without degradation of the overall rate. In some embodiments, an improvement in the overall etch rate can be achieved.

Abstract: A hydrofluorocarbon gas is employed as a polymer deposition gas in an anisotropic etch process employing an alternation of an etchant gas and the polymer deposition gas to etch a deep trench in a semiconductor substrate. The hydrofluorocarbon gas can generate a thick carbon-rich and hydrogen-containing polymer on sidewalls of a trench at a thickness on par with the thickness of the polymer on a top surface of the semiconductor substrate. The thick carbon-rich and hydrogen-containing polymer protects sidewalls of a trench, thereby minimizing an undercut below a hard mask without degradation of the overall rate. In some embodiments, an improvement in the overall etch rate can be achieved.