Patents by Inventor Going Sik Kim
Going Sik Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160381792Abstract: A printed circuit board in accordance with an embodiment includes a core layer, a photo imagable dielectric layer, and an inner circuit layer. The core layer includes a core stiffener layer, a first metal layer formed on an upper surface of the core stiffener layer, and a second metal layer formed on a lower surface of the core stiffener layer. The photo imagable dielectric layer is formed on an upper surface and a lower surface of the core layer. The inner circuit layer is formed on the photo imagable dielectric layer.Type: ApplicationFiled: June 6, 2016Publication date: December 29, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jee-Soo MOK, Young-Gwan KO, Jung-Hyun PARK, Jae-Ean LEE, Young Kuk KO, Going-Sik KIM
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Publication number: 20160374198Abstract: A printed circuit board includes a core layer including a glass core, a first resin layer disposed on a first surface of the glass core, and a second resin layer formed on a second surface of the glass core; build-up layers disposed on the first and second surfaces of the core layer; and a conductive pattern formed in multiple layers on the build-up layers, wherein the core layer has asymmetric coefficients of thermal expansion opposing sides thereof with respect to a center of the glass core in a thickness direction.Type: ApplicationFiled: January 21, 2016Publication date: December 22, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Heung-Kyu KIM, Suk-Hyeon CHO, Chil-Woo KWON, Yul-Kyo CHUNG, Going-Sik KIM
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Patent number: 9338899Abstract: A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays.Type: GrantFiled: December 13, 2013Date of Patent: May 10, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yang Je Lee, Il Woon Shin, Going Sik Kim, Doo Pyo Hong, Ha Il Kim, Dong Gi An
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Publication number: 20150177621Abstract: Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein the multi-layer insulating layer is formed of heterogeneous materials.Type: ApplicationFiled: February 27, 2015Publication date: June 25, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Woo LEE, Going Sik Kim
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Patent number: 8981549Abstract: The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate.Type: GrantFiled: December 29, 2011Date of Patent: March 17, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hye Jin Kim, Going Sik Kim, Chang Sup Ryu
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Publication number: 20140166355Abstract: Disclosed herein is a method of manufacturing a printed circuit board, the method including: (a) performing a hole processing process on one surface of a core layer to process a first via hole having a predetermined height hl; (b) performing a plating process on one surface of the core layer to form a first via electrode in the first via hole and form a first metal layer on one surface of the core layer; (c) performing a hole processing process on the other surface of the core layer to process a second via hole having a predetermined height h2 exposing a lower surface of the first via electrode to the outside; and (d) performing a plating process on the other surface of the core layer to form a second via electrode in the second via hole and form a second metal layer on the other surface of the core layer.Type: ApplicationFiled: July 26, 2013Publication date: June 19, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Suk Gi Hong, Jeong Woo Lee, Going Sik Kim, Hyo Seung Nam
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Publication number: 20140105712Abstract: The present invention relates to a jig unit for fixing a substrate and a substrate transfer apparatus including the same. In accordance with an embodiment of the present invention, a jig unit for fixing a substrate including: a support part for supporting an edge-side lower portion of a substrate; a hinge part having a hinge formed at a predetermined height from an upper surface of the substrate supported to the support part and rotating so that a rotation range by the hinge applies a force to the edge side of the substrate beyond the range that vertically presses the upper surface of the substrate; and a substrate fixing part for fixing the substrate to the support unit flatly by applying tension to the edge side of the substrate simultaneously with pressing the upper surface of the substrate is provided.Type: ApplicationFiled: September 5, 2013Publication date: April 17, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Taek Lim, Sang Yup Lee, Youn Chul Nam, Sung Joon Lee, Going Sik Kim, Byeong Mun Kim
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Publication number: 20140096383Abstract: A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays.Type: ApplicationFiled: December 13, 2013Publication date: April 10, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je LEE, Il Woon Shin, Going Sik Kim, Doo Pyo Hong, Ha Il Kim, Dong Gi An
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Publication number: 20140041902Abstract: Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein the multi-layer insulating layer is formed of heterogeneous materials.Type: ApplicationFiled: November 20, 2012Publication date: February 13, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Woo Lee, Going Sik Kim
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Publication number: 20140034359Abstract: Disclosed herein is a printed circuit board including a base substrate, a photosensitive insulating layer formed on an upper portion of the base substrate, and a circuit pattern formed to be buried within the photosensitive insulating film.Type: ApplicationFiled: August 2, 2013Publication date: February 6, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Woo Lee, Going Sik Kim
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Patent number: 8631567Abstract: A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.Type: GrantFiled: March 8, 2010Date of Patent: January 21, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yang Je Lee, Il Woon Shin, Going Sik Kim, Doo Pyo Hong, Ha Il Kim, Dong Gi An
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Publication number: 20130153280Abstract: Disclosed herein is a printed circuit board including: a substrate; first upper and lower insulating layers covering upper and lower sides of the substrate; a via penetrating the substrate and the first upper and lower insulating layers to form an electrical connection; and second upper and lower insulating layers covering or surrounding the via, wherein the first upper and lower insulating layers or the second upper and lower insulating layers include a general circuit region including general circuit patterns and circuit patterns connected to the via and a microcircuit region including microcircuit patterns having a smaller circuit line width than that of the general circuit region.Type: ApplicationFiled: March 21, 2012Publication date: June 20, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon Kim, Going Sik Kim
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Publication number: 20120168960Abstract: The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate.Type: ApplicationFiled: December 29, 2011Publication date: July 5, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Jin KIM, Going Sik KIM, Chang Sup RYU
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Publication number: 20120138336Abstract: Disclosed herein is a printed circuit board and a method of manufacturing the same, in which a circuit pattern one end of which is embedded in a trench and the other end of which protrudes from an insulating layer is formed, so that the circuit pattern is not easily separated from the insulating layer and the separation problems of the circuit pattern due to undercutting are solved. Also, the adhesion between the insulating layer and the circuit pattern is enhanced, more stably forming a fine circuit pattern. Even when a plating resist is formed thin, it is possible to form the circuit pattern, resulting in a high-solution circuit pattern.Type: ApplicationFiled: April 20, 2011Publication date: June 7, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ryoichi WATANABE, Going Sik KIM, Chang Sup RYU
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Publication number: 20100162562Abstract: A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.Type: ApplicationFiled: March 8, 2010Publication date: July 1, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je LEE, Il Woon Shin, Going Sik Kim, Doo Pyo Hong, Ha Il Kim, Dong Gi An
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Publication number: 20100147563Abstract: Disclosed is a substrate having an electromagnetic shielding member, which includes a first circuit layer connected to a ground layer, a coverlay formed on the first circuit layer, an electromagnetic shielding member formed on the coverlay, and a first via formed in the coverlay to connect the electromagnetic shielding member to the first circuit layer, so that the electromagnetic shielding member and the ground layer are connected to each other through a via structure, thereby preventing the electromagnetic shielding member from becoming cracked due to the stepped portion of the substrate.Type: ApplicationFiled: June 2, 2009Publication date: June 17, 2010Applicant: SAMSUNG ELECTRO MECHANICS CO., LTD.Inventors: Young Po Park, Going Sik Kim, Hwan Yong Jung, Ha II Kim, Dong Gi An, Myeong Hui Jung
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Publication number: 20080257742Abstract: Disclosed is a method of manufacturing a printed circuit board for a semiconductor package, which minimizes or completely obviates masking work upon the plating of each pad for the surface treatment of a printed circuit board for a semiconductor package, thereby simplifying the overall process and increasing the mounting reliability.Type: ApplicationFiled: January 8, 2008Publication date: October 23, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je Lee, Going Sik Kim, Dong Gi An, Mi Jung Han, Kyung Jin Heo, Young Kyu Lim
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Publication number: 20080014768Abstract: The present invention relates to a rigid-flexible printed circuit board and, more particularly, to a rigid-flexible printed circuit board including CL via holes which can facilitate electrical connection to an inner circuit pattern in a flexible region. Since the coverlays are layered on the entire surface of the double-sided FCCL without previous processing thereof, the via holes are formed in the coverlays while a drilling process is performed to form the via holes, and then the copper plating is performed over the entire surface thereof, it is possible to eliminate the cost of previously processing the coverlays, easily perform a process of provisionally layering the coverlays on the double-sided FCCL, and decrease the cost therefor.Type: ApplicationFiled: February 21, 2007Publication date: January 17, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je Lee, Il Woon Shin, Going Sik Kim, Doo Pyo Hong, Ha Il Kim, Dong Gi An