Patents by Inventor Goji Shiga

Goji Shiga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE
    Publication number: 20110156279
    Abstract: The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 30, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Takeshi MATSUMURA, Goji SHIGA
  • FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE
    Publication number: 20110156278
    Abstract: The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has an elastic modulus (at 50° C.) of 10 MPa or less and the laser marking layer has an elastic modulus (at 50° C.) of 100 MPa or more.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 30, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Takeshi MATSUMURA, Goji SHIGA
  • DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
    Publication number: 20110156277
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 30, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Takeshi MATSUMURA, Goji SHIGA