Abstract: Provided is a connection structure for a power conversion device to be mounted in a vehicle, including: a casing of the power conversion device; an electric connection part, which is to be mechanically connected to the casing, and is configured to electrically connect the power conversion device and an external device to each other; and an electric conductor configured to electrically connect the power conversion device and the electric connection part to each other, wherein the casing and the electric connection part are mechanically connected to each other through intermediation of an anti-vibration structure, and wherein the electric conductor has such flexibility as to be able to follow a relative displacement between the casing and the electric connection part.

Abstract: Provided is a connection structure for a power conversion device to be mounted in a vehicle, including: a casing of the power conversion device; an electric connection part, which is to be mechanically connected to the casing, and is configured to electrically connect the power conversion device and an external device to each other; and an electric conductor configured to electrically connect the power conversion device and the electric connection part to each other, wherein the casing and the electric connection part are mechanically connected to each other through intermediation of an anti-vibration structure, and wherein the electric conductor has such flexibility as to be able to follow a relative displacement between the casing and the electric connection part.

Abstract: A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.

Abstract: A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.