Patents by Inventor Goksen G. Yaralioglu
Goksen G. Yaralioglu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220317463Abstract: A head-up display device/system includes a dynamically adjustable exit pupil plane. More specifically, the system and the teaching contained herein along with various embodiments relate to head-up display devices comprising at least one picture generation unit and optical steering apparatus which together form a means for displaying 2D and/or 3D virtual augmented images using the surfaces of objects such as windshields.Type: ApplicationFiled: May 16, 2022Publication date: October 6, 2022Applicant: CY VISION INC.Inventors: Hakan UREY, Georgios Skolianos, Erdem ULUSOY, Goksen G. Yaralioglu, Trevor Chan
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Publication number: 20210373330Abstract: A device and a system includes a head-up display intended to be used to display projected images on surface such as an interior surface of a vehicle windshield. The device and system more particularly relates to a holographic head-up display device, a light module comprising a light source, together with a spatial light modulator displaying a computer-generated hologram once unmodulated beams are filtered using an optical filter. Said HUD device further comprises a head-tracking system for measurement of and adjustment according to interpupillary distance, a processor circuitry for said adjustment and processing pertaining thereto to be undertaken, as well as an optical steering apparatus.Type: ApplicationFiled: August 12, 2021Publication date: December 2, 2021Applicant: CY VISION INC.Inventors: Hakan UREY, Georgios Skolianos, Erdem ULUSOY, Goksen G. Yaralioglu, Trevor Chan
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Patent number: 9846175Abstract: A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers. Each of the at least two proof masses is anchored to the sense substrate via at least one flexure and electrically isolated from each other; and the at least two proof masses are capable of rotating in-plane about a Z-axis relative to the sense substrate, wherein the Z-axis is normal to the substrate. Each of the transducers can sense rotation of each proof mass with respect to the sense substrate in response to a rotation of the rotational sensor.Type: GrantFiled: January 27, 2015Date of Patent: December 19, 2017Assignee: INVENSENSE, INC.Inventors: Steven S. Nasiri, Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri
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Patent number: 9302902Abstract: A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.Type: GrantFiled: February 10, 2014Date of Patent: April 5, 2016Assignee: INVENSENSE, INC.Inventors: Goksen G. Yaralioglu, Martin Lim
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Publication number: 20150135831Abstract: A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers. Each of the at least two proof masses is anchored to the sense substrate via at least one flexure and electrically isolated from each other; and the at least two proof masses are capable of rotating in-plane about a Z-axis relative to the sense substrate, wherein the Z-axis is normal to the substrate. Each of the transducers can sense rotation of each proof mass with respect to the sense substrate in response to a rotation of the rotational sensor.Type: ApplicationFiled: January 27, 2015Publication date: May 21, 2015Inventors: Steven S. NASIRI, Goksen G. YARALIOGLU, Joseph SEEGER, Babak TAHERI
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Patent number: 8960002Abstract: Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.Type: GrantFiled: April 28, 2011Date of Patent: February 24, 2015Assignee: Invensense, Inc.Inventors: Steven S. Nasiri, Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri
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Patent number: 8847693Abstract: A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.Type: GrantFiled: April 16, 2012Date of Patent: September 30, 2014Assignee: Invensense, Inc.Inventors: Joseph Seeger, Goksen G. Yaralioglu, Baris Cagdaser
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Publication number: 20140151869Abstract: A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.Type: ApplicationFiled: February 10, 2014Publication date: June 5, 2014Applicant: INVENSENSE, INC.Inventors: Goksen G. YARALIOGLU, Martin LIM
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Patent number: 8686555Abstract: A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.Type: GrantFiled: June 19, 2012Date of Patent: April 1, 2014Assignee: Invensense, Inc.Inventors: Goksen G. Yaralioglu, Martin Lim
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Patent number: 8508039Abstract: In a method and system in accordance with the present invention, solder balls are added on top of vertically integrated MEMS with CMOS by using wafer scale fabrication compatible with existing chip scale packaging capabilities. In the present invention, both the MEMS and the CMOS dies are fabricated in equal dimensions. On the MEMS level, silicon islands are defined by DRIE etching to be bonded on top of CMOS pads. These conducting silicon islands later provide electrical connections between the CMOS pads and the conducting traces that lead to solder balls on top.Type: GrantFiled: May 8, 2008Date of Patent: August 13, 2013Assignee: Invensense, Inc.Inventors: Steven S. Nasiri, Goksen G. Yaralioglu
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Publication number: 20130001550Abstract: A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.Type: ApplicationFiled: June 28, 2012Publication date: January 3, 2013Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Igor TCHERTKOV, Hasan AKYOL, Goksen G. YARALIOGLU, Steven S. NASIRI, Ilya GURIN
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Publication number: 20130001765Abstract: A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.Type: ApplicationFiled: June 19, 2012Publication date: January 3, 2013Applicant: INVENSENSE, INC.Inventors: Goksen G. YARALIOGLU, Martin LIM
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Publication number: 20120200362Abstract: A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.Type: ApplicationFiled: April 16, 2012Publication date: August 9, 2012Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Goksen G. YARALIOGLU, Baris CAGDASER
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Patent number: 8183944Abstract: A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.Type: GrantFiled: April 3, 2009Date of Patent: May 22, 2012Assignee: Invensense, Inc.Inventors: Joseph Seeger, Goksen G. Yaralioglu, Baris Cagdaser
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Publication number: 20110197677Abstract: Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.Type: ApplicationFiled: April 28, 2011Publication date: August 18, 2011Applicant: InvenSense, Inc.Inventors: Steven S. NASIRI, Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri
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Patent number: 7934423Abstract: Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.Type: GrantFiled: December 10, 2007Date of Patent: May 3, 2011Assignee: Invensense, Inc.Inventors: Steven S. Nasiri, Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri
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Patent number: 7863698Abstract: An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.Type: GrantFiled: April 3, 2009Date of Patent: January 4, 2011Assignee: Invensense, Inc.Inventors: Joseph Seeger, Goksen G. Yaralioglu, Bruno Borovic, Alexander Castro
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Publication number: 20100252897Abstract: An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.Type: ApplicationFiled: April 3, 2009Publication date: October 7, 2010Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Goksen G. YARALIOGLU, Bruno BOROVIC, Alexander CASTRO
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Publication number: 20100253437Abstract: A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.Type: ApplicationFiled: April 3, 2009Publication date: October 7, 2010Applicant: INVENSENSE, INC.Inventors: Joseph SEEGER, Goksen G. YARALIOGLU, Baris CAGDASER
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Patent number: 7694552Abstract: A mechanical resonator capable of providing an intrinsically high mechanical quality factor in immersion is provided. The resonator includes a membrane attached at its perimeter to a frame, such that a front side of the membrane is in contact with the liquid, and the back side of the membrane is not in contact with the liquid or the frame. The membrane can act as a mechanical resonator. The quality factor of this resonator is enhanced by providing a pressure release boundary region on the frame in proximity to the membrane and in contact with the liquid. The pressure release boundary region provides a soft boundary condition, in the sense that a mechanical impedance on the solid side of the solid-liquid interface is less than the liquid mechanical impedance. Providing such a soft boundary condition reduces the mechanical energy loss due to excitation of waves in the liquid, thereby improving resonator quality factor. Such high-Q resonators are particularly useful for sensor applications.Type: GrantFiled: February 11, 2008Date of Patent: April 13, 2010Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Butrus T. Khuri-Yakub, Goksen G. Yaralioglu