Abstract: Embossing of metallic glass supercooled liquids into templates is emerging as a precision net-shaping and surface patterning technique for metals. Here, the effect of thickness of metallic glass on template-based embossing is disclosed. The results show that the existing embossing theory developed for thick samples fails to describe the process when the thickness of metallic glass becomes comparable to the template cavity diameter. Increased flow resistance at the cavity entrance results in viscous buckling of supercooled liquid instead of filling. A new phenomenological equation is proposed to describe the thickness dependent filling of template cavities. The buckling phenomenon is analyzed based on the folding model of multilayer viscous media. Controlled buckling can be harnessed in fabrication of metal microtubes, which are desirable for many emerging applications.

Abstract: The present invention includes composition and methods for the fabrication of very-high-aspect-ratio structures from metallic glasses. The present invention provides a method for nondestructive demolding of templates after thermoplastic molding of metallic glass features.

Abstract: An article comprising a bulk metallic glass skin having one or more functional features integrated therein is described and a method of forming the same is described. The one or more functional features exhibit a variation in stiffness between the one or more functional features and the bulk metallic glass skin that is defined by an applied force over an achieved deformation. The stiffness of each of the one or more functional features is at least 1000 times less than an average stiffness of the bulk metallic glass skin.

Abstract: The present invention includes composition and methods for the fabrication of very-high-aspect-ratio structures from metallic glasses. The present invention provides a method for nondestructive demolding of templates after thermoplastic molding of metallic glass features.

Abstract: A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3D) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3D mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.

Abstract: A method of processing BMGs in a non-ideal environment (such as air) to create a uniform and smooth surface is provided. By utilizing the contact-line movement and an engineered flow pattern during TPF the method is able to create complex BMG parts that exhibit uniform smooth appearance or even can be atomically smooth. In addition, to mending surface imperfections, this method also eliminates void formation inside the material, allows for the creation of precise patterns of homogeneous appearance, and forms improved mechanical locks between different materials and a BMG.

Abstract: A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.

Abstract: A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3D) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3D mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.

Abstract: A method of processing BMGs in a non-ideal environment (such as air) to create a uniform and smooth surface is provided. By utilizing the contact-line movement and an engineered flow pattern during TPF the method is able to create complex BMG parts that exhibit uniform smooth appearance or even can be atomically smooth. In addition, to mending surface imperfections, this method also eliminates void formation inside the material, allows for the creation of precise patterns of homogeneous appearance, and forms improved mechanical locks between different materials and a BMG.

Abstract: A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.

Abstract: The present invention relates to materials, methods and apparatuses for performing imprint lithography using amorphous metallic materials. The amorphous metallic materials can be employed as imprint media and thermoplastic forming processes are applied during the pattern transfer procedure to produce micron scale and nanoscale patterns in the amorphous metallic layer. The pattern transfer is in the form of direct mask embossing or through a serial nano-indentation process. A rewriting process is also disclosed, which involves an erasing mechanism that is accomplished by means of a second thermoplastic forming process. The amorphous metallic materials may also be used directly as an embossing mold in imprint lithography to allow high volume imprint nano-manufacturing. This invention also comprises of a method of smoothening surfaces under the action of the surface tension alone.

Abstract: The present invention relates to materials, methods and apparatuses for performing imprint lithography using amorphous metallic materials. The amorphous metallic materials can be employed as imprint media and thermoplastic forming processes are applied during the pattern transfer procedure to produce micron scale and nanoscale patterns in the amorphous metallic layer. The pattern transfer is in the form of direct mask embossing or through a serial nano-indentation process. A rewriting process is also disclosed, which involves an erasing mechanism that is accomplished by means of a second thermoplastic forming process. The amorphous metallic materials may also be used directly as an embossing mold in imprint lithography to allow high volume imprint nano-manufacturing. This invention also comprises of a method of smoothening surfaces under the action of the surface tension alone.

Abstract: Novel molds and methods for Bulk Metallic Glass (BMG) molding using carbon templates obtained from pyrolyzed materials are provided. The method employs the Carbon MEMS (C-MEMS) technique to derive molds of different geometries and dimensions. The resultant carbon structures are stable at very high temperatures and have sufficient mechanical strength to be used as master molds for the thermoplastic forming of BMGs.

Abstract: The present invention relates to materials, methods and apparatuses for performing imprint lithography using amorphous metallic materials. The amorphous metallic materials can be employed as imprint media and thermoplastic forming processes are applied during the pattern transfer procedure to produce micron scale and nanoscale patterns in the amorphous metallic layer. The pattern transfer is in the form of direct mask embossing or through a serial nano-indentation process. A rewriting process is also disclosed, which involves an erasing mechanism that is accomplished by means of a second thermoplastic forming process. The amorphous metallic materials may also be used directly as an embossing mold in imprint lithography to allow high volume imprint nano-manufacturing. This invention also comprises of a method of smoothening surfaces under the action of the surface tension alone.