Patents by Inventor Gong Bin Tang

Gong Bin Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250247080
    Abstract: Filter modules having a wider passband are provided herein. In certain embodiments, the filter module comprises an input node; an output node; a filter disposed along a signal path extending from the input node to the output node; a strip line configured to generate an inductance between the filter and a ground such to increase a bandwidth of a passband of the filter module, the single strip line disposed on multiple layers, each of the multiple layers defined by a plurality of pulse-shaped) portions of the strip line disposed on a plane.
    Type: Application
    Filed: January 22, 2025
    Publication date: July 31, 2025
    Inventors: Yulin Huang, Gong Bin Tang, Kyohei Kobayashi
  • Patent number: 12368431
    Abstract: An acoustic wave filter includes a piezoelectric layer. A first acoustic wave device includes a portion of the piezoelectric layer and a first multi-layer interdigital transducer electrode disposed over the first portion of the piezoelectric layer. Additional acoustic wave devices are coupled to the first acoustic wave device, the additional acoustic wave devices including a second portion of the piezoelectric layer and a plurality of multi-layer interdigital transducer electrodes disposed over the second portion of the piezoelectric layer. At least one of the plurality of multi-layer interdigital transducer electrodes includes a layer that is thinner than a corresponding layer of the same material of the first multi-layer interdigital transducer electrode of the first acoustic wave device.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: July 22, 2025
    Assignee: Skyworks Solutions, Inc.
    Inventors: Benjamin Paul Abbott, Gong Bin Tang, Rei Goto, Keiichi Maki
  • Patent number: 12341487
    Abstract: A surface acoustic wave device has a piezoelectric substrate having a cut angle (e.g., the piezoelectric angle is cut so as to have a crystal orientation) that allows the surface acoustic wave device to operate as a longitudinally leaky surface acoustic wave device that confines the acoustic wave energy within the piezoelectric substrate and that has less propagation attenuation and a higher electromechanical coupling coefficient k2.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: June 24, 2025
    Assignee: Skyworks Solutions, Inc.
    Inventors: Rei Goto, Keiichi Maki, Gong Bin Tang
  • Patent number: 12301208
    Abstract: An acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode disposed over the piezoelectric layer. The interdigital transducer electrode is thicker in a center region of the interdigital transducer electrode than in a gap region of the interdigital transducer electrode to thereby reduce a mass loading of the interdigital transducer electrode in the gap region. The interdigital transducer electrode has a layer of less dense material disposed of a layer of more dense material.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: May 13, 2025
    Assignee: Skyworks Solutions, Inc.
    Inventors: Benjamin Paul Abbott, Gong Bin Tang, Rei Goto, Keiichi Maki
  • Patent number: 12278614
    Abstract: An acoustic wave device, a method of manufacture of the same, and a radio frequency filter including the same. The acoustic wave device comprises a multilayer piezoelectric substrate (MPS) including a layer of piezoelectric material having a lower surface disposed on an upper surface of a layer of a dielectric material having a lower surface disposed on an upper surface of a carrier substrate. An interdigital transducer (IDT) is disposed on the multilayer piezoelectric substrate and includes an active region configured to generate an acoustic wave. First and second high impedance portions are included within the multilayer piezoelectric substrate, the first and second high impedance portions each positioned outside the active region of the interdigital transducer and extending in the direction of propagation of the acoustic wave to be generated by the interdigital transducer. The first and second high impedance portions reduce side leakage and suppress transverse modes.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: April 15, 2025
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Rei Goto, Gong Bin Tang, Keiichi Maki, Hironori Fukuhara
  • Patent number: 12237828
    Abstract: Filter modules having a wider passband are provided herein. In certain embodiments, the filter module comprises an input node; an output node; a filter disposed along a signal path extending from the input node to the output node; a strip line configured to generate an inductance between the filter and a ground such to increase a bandwidth of a passband of the filter module, the single strip line disposed on multiple layers, each of the multiple layers defined by a plurality of pulse-shaped) portions of the strip line disposed on a plane.
    Type: Grant
    Filed: March 3, 2023
    Date of Patent: February 25, 2025
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yulin Huang, Gong Bin Tang, Kyohei Kobayashi
  • Patent number: 12212071
    Abstract: Reconfigurable patch antenna systems are provided herein. In certain embodiments, a mobile device includes a patch antenna configured to handle a radio frequency signal at a signal feed. The patch antenna includes a plurality of antenna segments. The front-end system further includes a plurality of switches each configured to control connection of a respective one of the first plurality of antenna segments to the first signal feed, and a control circuit configured to control the plurality of switches to provide a frequency adjustment to the patch antenna.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: January 28, 2025
    Assignee: Skyworks Solutions, Inc.
    Inventors: Paul T. DiCarlo, William J. Domino, David Richard Pehlke, Grant Darcy Poulin, Gong Bin Tang
  • Publication number: 20240348229
    Abstract: Aspects of this disclosure relate to a filter that includes an acoustic wave device with a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate (e.g., a quartz substrate), a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave device. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. The thermally conductive layer has a thickness that is greater than 10 nanometers and less than a thickness of the piezoelectric layer.
    Type: Application
    Filed: June 21, 2024
    Publication date: October 17, 2024
    Inventors: Keiichi Maki, Rei Goto, Gong Bin Tang, Yosuke Hamaoka
  • Publication number: 20240339987
    Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.
    Type: Application
    Filed: June 20, 2024
    Publication date: October 10, 2024
    Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura
  • Patent number: 12047053
    Abstract: Aspects of this disclosure relate to a surface acoustic wave resonator having a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. Related surface acoustic wave filters, radio frequency modules, and wireless communication devices are also disclosed.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: July 23, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Keiichi Maki, Rei Goto, Gong Bin Tang, Yosuke Hamaoka
  • Patent number: 12040784
    Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: July 16, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura
  • Patent number: 11962283
    Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: April 16, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
  • Patent number: 11824515
    Abstract: An acoustic wave device that includes a spinel layer, a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer is disclosed. The piezoelectric layer is disposed between the interdigital transducer electrode and the spinel layer. The acoustic wave device is configured to generate an acoustic wave having a wavelength of ?. The piezoelectric layer can have a thickness than is less than ?. In some embodiments, the acoustic wave device can include a temperature compensating layer that is disposed between the piezoelectric layer and the spinel layer.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: November 21, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura, Keiichi Maki
  • Publication number: 20230308081
    Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.
    Type: Application
    Filed: February 23, 2023
    Publication date: September 28, 2023
    Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura
  • Publication number: 20230283261
    Abstract: Filter modules having a wider passband are provided herein. In certain embodiments, the filter module comprises an input node; an output node; a filter disposed along a signal path extending from the input node to the output node; a strip line configured to generate an inductance between the filter and a ground such to increase a bandwidth of a passband of the filter module, the single strip line disposed on multiple layers, each of the multiple layers defined by a plurality of pulse-shaped) portions of the strip line disposed on a plane.
    Type: Application
    Filed: March 3, 2023
    Publication date: September 7, 2023
    Inventors: Yulin Huang, Gong Bin Tang, Kyohei Kobayashi
  • Patent number: 11750172
    Abstract: A surface acoustic wave (SAW) resonator comprises a plurality of interdigital transducer electrodes disposed on a multilayer piezoelectric substrate (MPS) including a layer of piezoelectric material having a lower surface bonded to an upper surface of a layer of a second material different from the piezoelectric material that improves the temperature stability and reliability of the SAW resonator, and a layer of dielectric material disposed on an upper surface of the interdigital transducer electrodes and MPS.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: September 5, 2023
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Rei Goto, Keiichi Maki, Gong Bin Tang
  • Publication number: 20230275565
    Abstract: Acoustic wave resonators are disclosed that include a piezoelectric layer and an interdigital transducer electrode over the piezoelectric layer. The interdigital transducer electrode has a rotation angle and a tilt angle. The rotation angle and the tilt angle can together increase a figure of merit of the acoustic wave device. The rotation angle and the tilt angle can both be non-zero.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 31, 2023
    Inventors: Gong Bin Tang, Rei Goto
  • Patent number: 11722122
    Abstract: A surface acoustic wave (SAW) resonator comprises a plurality of interdigital transducer (IDT) electrodes disposed on a multilayer piezoelectric substrate including a layer of piezoelectric material having a lower surface bonded to an upper surface of a layer of a dielectric material. The dielectric material has a lower surface bonded to an upper surface of a carrier substrate. The plurality of IDT electrodes include an upper layer and a lower layer. The upper layer is formed of a material having a higher conductivity than the lower layer. The lower layer is formed of a material having a higher density than the upper layer to provide for reduction in size of the SAW resonator.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: August 8, 2023
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Rei Goto, Gong Bin Tang, Keiichi Maki
  • Publication number: 20230208385
    Abstract: Acoustic wave device is disclosed. the acoustic wave device can include a piezoelectric layer and an interdigital transducer electrode over the piezoelectric layer. The interdigital transducer electrode has a non-zero tilt angle. The non-zero tilt angle can between 5° to 15°. A thickness of the interdigital transducer electrode is at least 40% of a thickness of the piezoelectric layer, 400 nm, or 0.08? where ? is the wavelength generated by the acoustic wave device.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 29, 2023
    Inventors: Yuya Hiramatsu, Gong Bin Tang
  • Publication number: 20230208396
    Abstract: Acoustic wave device is disclosed. the acoustic wave device can include a piezoelectric layer and an interdigital transducer electrode over the piezoelectric layer. The interdigital transducer electrode having a non-zero tilt angle. The non-zero tilt angle can between 5° to 15°. The interdigital transducer electrode is configured to shift stopband of the acoustic wave device and to reduce a slanted stopband.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 29, 2023
    Inventors: Yuya Hiramatsu, Gong Bin Tang