Patents by Inventor Gong Shun Qiang

Gong Shun Qiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits with copper hillock-detecting structures and methods for detecting copper hillocks using the same
    Patent number: 9881844
    Abstract: An integrated circuit includes a copper hillock-detecting structure. The copper hillock-detecting structure includes a copper metallization layer and an intermediate plate structure spaced apart from adjacent to the copper metallization layer. The intermediate plate structure includes a conducting material plate. The intermediate plate structure further includes a plurality of conductive vias that are electrically and physically connected with the conducting material plate. The copper hillock-detecting structure further includes a sensing plate adjacent to the intermediate plate and electrically and physically connected with the plurality of vias such that the vias are disposed between the intermediate plate and the sensing plate.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: January 30, 2018
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Wanbing Yi, Juan Boon Tan, Wei Shao, Gong Shun Qiang
  • INTEGRATED CIRCUITS WITH COPPER HILLOCK-DETECTING STRUCTURES AND METHODS FOR DETECTING COPPER HILLOCKS USING THE SAME
    Publication number: 20150177319
    Abstract: Integrated circuits with copper hillock-detecting structures and methods for detecting copper hillocks using the same are disclosed. In an exemplary embodiment, an integrated circuit includes a copper hillock-detecting structure. The copper hillock-detecting structure includes a copper metallization layer and an intermediate plate structure adjacent to the copper metallization layer. The intermediate plate structure includes a conducting material plate. The intermediate plate structure further includes a plurality of vias electrically and physically connected with the conducting material plate. The copper hillock-detecting structure further includes a sensing plate adjacent to the intermediate plate and electrically and physically connected with the plurality of vias.
    Type: Application
    Filed: December 19, 2013
    Publication date: June 25, 2015
    Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Wanbing YI, Juan Boon Tan, Wei Shao, Gong Shun Qiang