Patents by Inventor Gonglin Luo

Gonglin Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250014931
    Abstract: Provided is a process platform, relating to the field of semiconductor technologies and specifically. The process platform includes a conveying bin, an accommodating bin, and reaction chambers. The conveying bin is internally provided with a first conveying part having grabbing mechanisms. The accommodating bin is communicated with the conveying bin and used for loading a wafer. The reaction chambers are each communicated with the conveying bin, at least one wafer carrying table is arranged in each reaction chamber, and liftable ejector pins are arranged on a top surface of the wafer carrying table.
    Type: Application
    Filed: July 2, 2024
    Publication date: January 9, 2025
    Inventors: Haiwei LI, Changle GUAN, Wenbin ZHAO, Gonglin LUO, Qiang FAN
  • Publication number: 20240404858
    Abstract: The present disclosure provides a transfer apparatus and a processing system. The transfer apparatus includes a first transfer assembly configured to transfer a first workpiece to a chamber. The transfer apparatus includes a second transfer assembly configured to transfer a second workpiece from the chamber. The transfer apparatus includes an isolation assembly disposed between the first transfer assembly and the second transfer assembly and configured to isolate energy transfer between the first workpiece and the second workpiece. The transfer apparatus further includes a support assembly configured to restrict the isolation assembly between the first transfer assembly and the second transfer assembly.
    Type: Application
    Filed: August 13, 2024
    Publication date: December 5, 2024
    Inventors: Mengyang Xin, Fei Yu, Gonglin Luo
  • Patent number: 12087608
    Abstract: The present disclosure provides a transfer apparatus and a processing system. The transfer apparatus includes a first transfer assembly configured to transfer a first workpiece to a chamber. The transfer apparatus includes a second transfer assembly configured to transfer a second workpiece from the chamber. The transfer apparatus includes an isolation assembly disposed between the first transfer assembly and the second transfer assembly and configured to isolate energy transfer between the first workpiece and the second workpiece. The transfer apparatus further includes a support assembly configured to restrict the isolation assembly between the first transfer assembly and the second transfer assembly.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: September 10, 2024
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd, Mattson Technology, Inc.
    Inventors: Mengyang Xin, Fei Yu, Gonglin Luo
  • Publication number: 20230005772
    Abstract: The present disclosure provides a transfer apparatus and a processing system. The transfer apparatus includes a first transfer assembly configured to transfer a first workpiece to a chamber. The transfer apparatus includes a second transfer assembly configured to transfer a second workpiece from the chamber. The transfer apparatus includes an isolation assembly disposed between the first transfer assembly and the second transfer assembly and configured to isolate energy transfer between the first workpiece and the second workpiece. The transfer apparatus further includes a support assembly configured to restrict the isolation assembly between the first transfer assembly and the second transfer assembly.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 5, 2023
    Inventors: Mengyang Xin, Fei Yu, Gonglin Luo