Abstract: A semiconductor structure includes a substrate, a bit line, and a first isolation layer. A groove is set in the substrate. A bottom end of the bit line is set in the groove. The first isolation layer is at least partially set on a sidewall of the bit line, and the first isolation layer is in direct contact with the bit line.

Abstract: Embodiments of the present application provide a semiconductor structure formation method and a semiconductor structure. The method includes: the substrate including contact region and dummy region, a first bitline structure and a first dielectric layer being formed on the substrate, the first bitline structure and the first dielectric layer defining discrete capacitor contact openings; forming a first sacrificial layer filling the capacitor contact opening; removing, in the dummy region, part of height of the first bitline structure, part of height of the first dielectric layer and part of height of the first sacrificial layer to form a first opening located at top of a second bitline structure, a second dielectric layer and a second sacrificial layer; forming an insulation layer filling the first opening; removing, in the contact region, the first sacrificial layer to form a second opening; and forming a capacitor contact structure located in the second opening.

Abstract: A cooling apparatus, comprising a mainboard and a cooling fan, where the novel cooling apparatus comprises: a heat sink, provided on the mainboard and affixed to one end of a vent of the cooling fan. The heat sink comprises: a groove, used for accommodating a heat-generating component provided on the mainboard; cooling fins, distributed within the heat sink and arranged on two sides of the groove. A venting and cooling channel is constituted between the interior of the heat sink and the vent of the cooling fan. The beneficial effect of the technical solution is such that, with other heat-generating components placed in the heat sink, the space in the heat sink is fully utilized, the fan is utilized to cool the heat sink and the heat-generating components therein, thus increasing the utilization rate of the fan, increasing the cooling efficiency, and effectively utilizing space.