Patents by Inventor Gopal GARG

Gopal GARG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11769951
    Abstract: An antenna apparatus includes antennas, each having first and second feeding portions facing each other across a dielectric layer, and third and fourth feeding portions facing each other across the dielectric layer, and a signal application unit configured to apply a wireless communication signal to the antennas, and including a plurality of output ports, wherein the first and second feeding portions are configured to receive electric signals having a first polarization characteristic, and are respectively connected to first and second output ports that are different from each other among the plurality of output ports, and the third and fourth feeding portions are configured to receive electric signals having a second polarization characteristic that is different from the first polarization characteristic, and are respectively connected to third and fourth output ports that are different from each other among the plurality of output ports.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: September 26, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyungjin Lee, Woncheol Lee, Myeong Woo Han, Jeongki Ryoo, Youngsik Hur, Wongi Kim, Gopal Garg
  • Publication number: 20230292439
    Abstract: A printed circuit board includes a substrate structure including a first insulating material, a plurality of first wiring layers disposed on or in the first insulating material, and a plurality of first via layers disposed in the first insulating material; and an interconnect structure including a second insulating material, a plurality of second wiring layers disposed on or in the second insulating material, and one or more second via layers disposed in the second insulating material. The interconnect structure is disposed on an upper side of the substrate structure. The interconnect structure includes first and second connection regions. The first and second connection regions are spaced apart from each other.
    Type: Application
    Filed: September 28, 2022
    Publication date: September 14, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gopal GARG, Jung Hyun CHO, Yong Ho BAEK
  • Publication number: 20220085505
    Abstract: An antenna apparatus includes antennas, each having first and second feeding portions facing each other across a dielectric layer, and third and fourth feeding portions facing each other across the dielectric layer, and a signal application unit configured to apply a wireless communication signal to the antennas, and including a plurality of output ports, wherein the first and second feeding portions are configured to receive electric signals having a first polarization characteristic, and are respectively connected to first and second output ports that are different from each other among the plurality of output ports, and the third and fourth feeding portions are configured to receive electric signals having a second polarization characteristic that is different from the first polarization characteristic, and are respectively connected to third and fourth output ports that are different from each other among the plurality of output ports.
    Type: Application
    Filed: December 17, 2020
    Publication date: March 17, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyungjin LEE, Woncheol LEE, Myeong Woo HAN, Jeongki RYOO, Youngsik HUR, Wongi KIM, Gopal GARG