Abstract: Apparatus and methods for removing a dental crown from a tooth. Chemical bonds within an adhesive, between the adhesive and the crown, and between the adhesive and the tooth may secure the crown to the tooth. The chemical bonds may be weakened. After weakening the bonds, the crown may not be securely affixed to the tooth. After weakening the bonds, the crown may be easily removed from the tooth. The bonds may be weakened by applying ultrasonic waves to the adhesive. Sonic energy of the waves may heat the adhesive. The bonds may be weakened by positioning the adhesive within an electric field. The bonds may be weakened by applying heat to the adhesive. The heating may cause particles within the adhesive to expand. The electric field and/or the sonic energy may be applied via an electronic tool.

Abstract: Methods and systems for using a curable material for endodontic processes are provided. The method comprises using an electroactive composition to cure and optionally un-cure the material. Using an electroactive composition allows for easy introduction of the material without unwanted complexity or side effects. It also allows for easy removal and replacement if desired.