Patents by Inventor Gor Amie Lai

Gor Amie Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming reinforced interconnects on a substrate
    Patent number: 7494924
    Abstract: A method for forming reinforced interconnects or bumps on a substrate includes first forming a support structure on the substrate. A substantially filled capsule is then formed around the support structure to form an interconnect. The interconnect can reach a height of up to 300 microns.
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: February 24, 2009
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Hei Ming Shiu, On Lok Chau, Gor Amie Lai, Heng Keong Yip, Thoon Khin Chang, Lan Chu Tan
  • Method for forming multi-layer bumps on a substrate
    Patent number: 7422973
    Abstract: A method for forming multi-layer bumps on a substrate includes depositing an adhesive or a flux on the substrate, depositing a first metal powder on the adhesive, and melting or reflowing the adhesive and first metal powder to form first bumps. An adhesive or a flux and a second metal powder are then deposited on the first bumps, and melted to form second bumps on the first bumps to form multi-layer bumps. The multi-layer bumps are formed without the need for any wet chemicals.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: September 9, 2008
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Hei Ming Shiu, On Lok Chau, Gor Amie Lai
  • Method for forming multi-layer bumps on a substrate
    Patent number: 7279409
    Abstract: A method for forming multi-layer bumps on a substrate includes depositing a first metal powder on the substrate, and selectively melting or reflowing a portion of the first metal powder to form first bumps. A second metal powder is then deposited on the first bumps, and melted to form second bumps on the first bumps. A masking plate is disposed over the substrate to select the portions of the metal powders that are melted and the metal powders are melted via an irradiation beam. The multi-layer bump is formed without the need for any wet chemicals.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: October 9, 2007
    Assignee: Freescale Semiconductor, Inc
    Inventors: Hei Ming Shiu, On Lok Chau, Gor Amie Lai