Patents by Inventor Gordana Felic

Gordana Felic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9257751
    Abstract: A monolithic antenna element comprises a microstrip patch antenna and a ground plane, with a substrate between the patch antenna and the ground plane. A feeding via extends from the ground plane layer through the substrate to the patch antenna, connecting to the antenna distal from lateral edges of the antenna. A coplanar waveguide (CPW) feed line is formed in the ground plane layer, and interrupts and is electrically distinct from the ground plane. The CPW extends from a lateral edge of the ground layer to the feeding via. The antenna can be flip chip bonded to a CMOS die, reducing cost of millimeter wave transceivers, e.g. 57-64 GHz. The antenna is fabricated using standard PCB technology and a single substrate for the antenna. Antenna arrays can be fabricated. Appropriately designed antenna feeds, flip chip interconnects and antenna shape provide suitably broad antenna bandwidth, with relatively high efficiency.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: February 9, 2016
    Assignee: Nitero Pty Limited
    Inventors: Gordana Felic, Stan Skafidas
  • Publication number: 20150207236
    Abstract: An antenna unit (100) comprises an antenna substrate (140) carrying one or more radiating elements (150), and a lens structure formed of a dielectric material, the lens structure comprising a lens (110) and at least one support member (120) arranged to support the antenna substrate (140) at a displacement relative to the lens (110).
    Type: Application
    Filed: July 25, 2013
    Publication date: July 23, 2015
    Inventors: Gordana Felic, Robin J. Evans, Efstratios Skafidas
  • Publication number: 20110260943
    Abstract: A monolithic antenna element comprises a microstrip patch antenna and a ground plane, with a substrate between the patch antenna and the ground plane. A feeding via extends from the ground plane layer through the substrate to the patch antenna, connecting to the antenna distal from lateral edges of the antenna. A coplanar waveguide (CPW) feed line is formed in the ground plane layer, and interrupts and is electrically distinct from the ground plane. The CPW extends from a lateral edge of the ground layer to the feeding via. The antenna can be flip chip bonded to a CMOS die, reducing cost of millimetre wave transceivers, e.g. 57-64 GHz. The antenna is fabricated using standard PCB technology and a single substrate for the antenna. Antenna arrays can be fabricated. Appropriately designed antenna feeds, flip chip interconnects and antenna shape provide suitably broad antenna bandwidth, with relatively high efficiency.
    Type: Application
    Filed: March 13, 2009
    Publication date: October 27, 2011
    Applicant: National ICT Australia Limited
    Inventors: Gordana Felic, Stan Skafidas