Patents by Inventor Gordon Alan Shaw

Gordon Alan Shaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8299506
    Abstract: A method of forming CMOS circuitry integrated with MEMS devices includes bonding a wafer to a top surface layer having contacts formed to CMOS circuitry. A handle wafer is then removed from one of the top or bottom surfaces of the CMOS circuitry, and MEMS devices are formed in a remaining silicon layer.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: October 30, 2012
    Assignee: Honeywell International Inc.
    Inventors: Andy Peczalski, Robert E. Higashi, Gordon Alan Shaw, Thomas Keyser
  • Publication number: 20100140670
    Abstract: A method of forming CMOS circuitry integrated with MEMS devices includes bonding a wafer to a top surface layer having contacts formed to CMOS circuitry. A handle wafer is then removed from one of the top or bottom surfaces of the CMOS circuitry, and MEMS devices are formed in a remaining silicon layer.
    Type: Application
    Filed: December 1, 2009
    Publication date: June 10, 2010
    Applicant: Honeywell International Inc.
    Inventors: Andy Peczalski, Robert E. Higashi, Gordon Alan Shaw, Thomas Keyser