Patents by Inventor Gordon C. Henderson

Gordon C. Henderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4654755
    Abstract: The present invention consists of a ground plane comprising a conductive foil placed between a printed wire board and a chassis. The foil is deformed to provide a plurality of raised areas such that if buckling of the printed wire board occurs, the deformed areas will continue to maintain contact between the printed wire board and the chassis.
    Type: Grant
    Filed: March 3, 1986
    Date of Patent: March 31, 1987
    Assignee: Motorola, Inc.
    Inventors: James M. Henderson, Gordon C. Henderson