Patents by Inventor Gordon Charles Osborne, Jr.

Gordon Charles Osborne, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for testing integrated circuit chips
    Patent number: 5672980
    Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.
    Type: Grant
    Filed: February 15, 1996
    Date of Patent: September 30, 1997
    Assignee: International Business Machines Corporation
    Inventors: Richard Gordon Charlton, George Charles Correia, Mark Andrew Couture, Gary Ray Hill, Kibby Barth Horsford, Anthony Paul Ingraham, Michael David Lowell, Voya Rista Markovich, Gordon Charles Osborne, Jr., Mark Vincent Pierson
  • Method and apparatus for testing integrated circuit chips
    Patent number: 5659256
    Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.
    Type: Grant
    Filed: February 15, 1996
    Date of Patent: August 19, 1997
    Assignee: International Business Machines Corporation
    Inventors: Richard Gordon Charlton, George Charles Correia, Mark Andrew Couture, Gary Ray Hill, Kibby Barth Horsford, Anthony Paul Ingraham, Michael David Lowell, Voya Rista Markovich, Gordon Charles Osborne, Jr., Mark Vincent Pierson