Abstract: An arc-mitigating fuse including a fuse body, a first endcap covering a first end of the fuse body and a second endcap covering a second end of the fuse body, a fusible element disposed within the fuse body and extending between the first endcap and the second endcap to provide an electrically conductive pathway therebetween, and a plurality of gas-evolving microbeads disposed within the fuse body surrounding the fusible element.

Abstract: A surface mount fuse includes a substrate, a fuse element applied to the substrate, first and second terminals applied to substrate, first and second conductors connecting the fuse element electrically with the first and second terminals, and an enclosure coupled to the substrate, the enclosure covering the first and second conductors and defining a cavity overlying at least a portion of the fuse element, the cavity allowing for distortion of the fuse element upon its opening.

Abstract: A fused conductor includes a first conductor portion, a second conductor portion, and a fuse element in electrical communication with the first and second conductor portions via at least one dual metal wire, the fuse element protected by a glass body bonded chemically to the dual metal wire.

Abstract: Reactive fuses that contain reactive fuse elements for use in electrical circuits and other applications are provided. In various exemplary embodiments reactive materials and reactive foils are employed to provide a focused, localized heat source which can by used to open or sever a fuse element, or precisely join one or more metallic components. In particular, reactive material can be utilized to open a fuse element in response to the heat generated by a sustained overload current. Alternatively, reactive material may be utilized in the construction of a reactive fuse to join, for example, metallic components to a base fuse element or fuse cap.

Abstract: In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.