Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device (IMD) while the device is implanted in a patient. The IMD may include a rechargeable battery having a battery housing; a non-metallic substrate attached to the battery housing, wherein the non-metallic substrate and the battery housing form an outer housing of the implantable medical device; control circuitry formed on the non-metallic substrate within the outer housing of the IMD; a receive coil within the outer housing of the IMD, the receive coil configured to receive energy from outside of the outer housing of the IMD; and recharge circuitry within the outer housing of the IMD and coupled to the receive coil, the recharge circuitry configured to receive the energy from the receive coil, and recharge the rechargeable battery using the received energy.

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device while the device is implanted in a patient. The implantable medical device in some examples include a receive antenna configuration that may include at least one infinity shaped receive coil. One or more of the receive coils may be affixed to a ferrite sheet formed having a curved shape that conforms to a curvature on an inner surface of a portion of a housing of the implantable medical device so that the ferrite sheet and the receive coil or coils may be positioned adjacent to some portion of the curved inner surface with the ferrite sheet positioned between the inner surface and the receive coil or coils.

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device while the device is implanted in a patient. The implantable medical device in some examples include a receive antenna configuration that may include at least one infinity shaped receive coil. One or more of the receive coils may be formed having a curved shape that conforms to a curvature on an inner surface of a portion of a housing of the implantable medical device so that the receive coil or coils may be positioned adjacent to, and in some examples in direct contact with, some portion of the curved inner surface.

Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device while the device is implanted in a patient. The implantable devices in some examples include a multi-axis antenna having a plurality of coil windings arranged orthogonal to one another. The multi-axis antenna configured to generate at least a minimum level of induced current for recharging a power source of the implanted medical device regardless of the orientation of a direction of a magnetic field imposed on the multi-axis antenna relative to an orientation of the implanted medical device and the multi-axis antenna for a given energy level of the imposed magnetic field.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Abstract: A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.

Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.

Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Abstract: A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.

Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device while the device is implanted in a patient. The implantable devices in some examples include a multi-axis antenna having a plurality of coil windings arranged orthogonal to one another. The multi-axis antenna configured to generate at least a minimum level of induced current for recharging a power source of the implanted medical device regardless of the orientation of a direction of a magnetic field imposed on the multi-axis antenna relative to an orientation of the implanted medical device and the multi-axis antenna for a given energy level of the imposed magnetic field.

Abstract: Systems, devices and methods are disclosed that allow recharging a power source located in an implanted medical device implanted in a patient, the recharging device comprising first and second pairs of electrical coils configured to generate first and second uniform magnetic fields in overlapping first and second cylindrical regions located between the respective pairs of electrical coils.

Abstract: Systems, devices and methods are disclosed that allow recharging a power source located in an implanted medical device implanted in a patient, the recharging device comprising first and second pairs of electrical coils configured to generate first and second uniform magnetic fields in overlapping first and second cylindrical regions located between the respective pairs of electrical coils.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.