Abstract: An automotive LED lamp unit includes a plate-like mounting member, LED light sources arranged on two opposite sides of the plate-like mounting member, and a heat sink. The heat sink includes cooling fins and a tapered portion facing the LED light sources and being connected to one end of the plate-like mounting member.

Abstract: An automotive LED lamp unit includes a plate-like mounting member, LED light sources arranged on two opposite sides of the plate-like mounting member, and a heat sink. The heat sink includes cooling fins and a tapered portion facing the LED light sources and being connected to one end of the plate-like mounting member.

Abstract: The present invention relates to a LED lamp unit (10) comprising at least two LED light sources (2) arranged between a heat sink (3) and an electrical connector base at two opposing sides of the lamp unit (10) to emit in opposed half spaces. The proposed LED lamp unit can be constructed in a very compact form in order to replace known halogen, xenon and incandescent bulbs without changing the construction of the reflector and mechanical parts in a head lamp or signaling lamp.

Abstract: The present invention relates to a method of soldering an electronic component (3) to a substrate (1) with high accuracy using transient liquid phase soldering. The component (3) is exactly positioned above the substrate (1) with a handling tool, placed in the melted solder (2) and pressed against the substrate (1). The component (3) is then released and the solder (2) allowed solidifying. Due to the use of a solder (2) having a sufficiently high amount of a second metal or metal alloy of a higher melting point which only partly dissolves in the melted first metal or metal alloy of a lower melting point, a solid framework forms during the liquid phase soldering which inhibits a lateral movement of the placed component (3) during soldering. Since the positioning of the component (3) is made using exact reference features on the substrate (1), the whole soldering process results in a highly accurate lateral position of the soldered component.

Abstract: The present invention relates to a method of soldering an electronic component (3) to a substrate (1) with high accuracy using transient liquid phase soldering. The component (3) is exactly positioned above the substrate (1) with a handling tool, placed in the melted solder (2) and pressed against the substrate (1). The component (3) is then released and the solder (2) allowed solidifying. Due to the use of a solder (2) having a sufficiently high amount of a second metal or metal alloy of a higher melting point which only partly dissolves in the melted first metal or metal alloy of a lower melting point, a solid framework forms during the liquid phase soldering which inhibits a lateral movement of the placed component (3) during soldering. Since the positioning of the component (3) is made using exact reference features on the substrate (1), the whole soldering process results in a highly accurate lateral position of the soldered component.

Abstract: The present invention relates to a LED lamp unit (10) comprising at least two LED light sources (2) arranged between a heat sink (3) and an electrical connector base at two opposing sides of the lamp unit (10) to emit in opposed half spaces. The proposed LED lamp unit can be constructed in a very compact form in order to replace known halogen, xenon and incandescent bulbs without changing the construction of the reflector and mechanical parts in a head lamp or signaling lamp.