Abstract: A gas distribution assembly for a processing chamber in a substrate processing system includes a gas plate including a plurality of holes configured to supply a gas mixture into an interior of the processing chamber and a carrier ring configured to support the gas plate. The carrier ring includes an annular body and a radially inwardly projecting portion. The radially inwardly projecting portion has a first inner diameter and the annular body has a second inner diameter greater than the first inner diameter, the radially inwardly projecting portion defines a ledge, and the gas plate is arranged on the ledge of the carrier ring. A dielectric window is arranged on the gas plate above the gas plate and the carrier ring such that the gas plate is supported between the carrier ring and the dielectric window.

Abstract: A gas distribution device for a substrate processing system includes an upper plate including a first hole and a plurality of second holes and a lower plate. The lower plate includes a recessed region formed in one of an upper surface of the lower plate and a lower surface of the upper plate. The recessed region defines a plenum volume between the upper plate and the lower plate. The lower plate further includes a raised fence located within the recessed region. The fence separates the plenum volume into a first plenum and a second plenum, the first plenum is in fluid communication with the first hole, and the second plenum is in fluid communication with the plurality of second holes.

Abstract: A consumable part and methods for tracking the consumable part includes embedding a radio frequency tag within a pocket created on a side of the consumable part that faces away from a process region defined within a process chamber of the processing tool and covering an opening of the pocket using a plug. The plug is laser fused along an interface formed between sidewalls of the plug and sidewalls of the pocket.

Abstract: A gas distribution plate for a substrate processing system includes an outer ring including a stepped interface on a radially inner surface thereof and N inner rings, where N is an integer greater than zero. At least one of the N inner rings is circumferentially segmented and includes an inner stepped interface and an outer stepped interface. An outer stepped interface of a radially outer one of the N inner rings is configured to rest on and mate with the inner stepped interface of the outer ring. A center portion includes an outer stepped interface on a radially outer surface thereof that is configured to rest on and mate with an inner stepped interface of a radially inner one of the N inner rings.

Abstract: A system for heating a dielectric window of a plasma processing chamber is provided. In one example, the method includes the use of a heating element. The heating element includes a dielectric disc and a conductive line formed in the dielectric disc. The conductive line includes a plurality of loops oriented radially around the dielectric disc. Each loop extends from a radial periphery of the dielectric disc toward a center of the dielectric disc. Each loop of the conductive line has an inward segment coupled to a return segment by a switchback segment. The inward segment is vertically aligned with the return segment.