Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.

Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.

Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.

Abstract: Embodiments of a system and method for using radio frequency (RF) resources are generally described herein. In some embodiments, the system includes an antenna subsystem including antenna apertures. The system may also include devices configured to execute a plurality RF tasks. The system may further include memory to store a prioritized list of RF tasks. The system may still further include a manager to receive a request from an RF task to use an antenna aperture. The manager may insert the RF task into a prioritized list of RF tasks within a time duration specified in the request. The manager may spawn a thread to execute the RF task through the antenna aperture, within a time frame depending on the RF task's position in the prioritized list.

Abstract: Embodiments of a system and method for using radio frequency (RF) resources are generally described herein. In some embodiments, the system includes an antenna subsystem including antenna apertures. The system may also include devices configured to execute a plurality RF tasks. The system may further include memory to store a prioritized list of RF tasks. The system may still further include a manager to receive a request from an RF task to use an antenna aperture. The manager may insert the RF task into a prioritized list of RF tasks within a time duration specified in the request. The manager may spawn a thread to execute the RF task through the antenna aperture, within a time frame depending on the RF task's position in the prioritized list.

Abstract: An RF aperture coldplate for positioning in heat transfer proximity to heat-generating elements of an RF antenna system is presented. The RF aperture coldplate has a front side and a rear side. The RF aperture coldplate includes waveguides each forming an opening therethrough from the front side to the rear side, and passages substantially around the waveguides. The passages are configured to conduct cooling medium around the waveguides and between the front side and the rear side of the RF aperture coldplate.

Abstract: An RF aperture coldplate for positioning in heat transfer proximity to heat-generating elements of an RF antenna system is presented. The RF aperture coldplate has a front side and a rear side. The RF aperture coldplate includes waveguides each forming an opening therethrough from the front side to the rear side, and passages substantially around the waveguides. The passages are configured to conduct cooling medium around the waveguides and between the front side and the rear side of the RF aperture coldplate.

Abstract: An RF aperture coldplate for positioning in heat transfer proximity to heat-generating elements of an RF antenna system is presented. The RF aperture coldplate has a front side and a rear side. The RF aperture coldplate includes waveguides each forming an opening therethrough from the front side to the rear side, and passages substantially around the waveguides. The passages are configured to conduct cooling medium around the waveguides and between the front side and the rear side of the RF aperture coldplate.

Abstract: According to one embodiment, simulating the mutual performance of an antenna array coupled to an electrical drive circuit includes receiving one or more cross-coupling matrices and a number of electrical circuit parameters. Each cross-coupling matrix comprises matrix elements that each represent a cross-coupling factor of one antenna element to another antenna element of the antenna array. The electrical circuit parameters model one or more characteristics of the electrical drive circuit. Performance of the microwave antenna array and the electrical drive circuit in a far-field environment is modeled according to the electrical circuit parameters and the cross-coupling matrices.

Abstract: An RF aperture coldplate for positioning in heat transfer proximity to heat-generating elements of an RF antenna system is presented. The RF aperture coldplate has a front side and a rear side. The RF aperture coldplate includes waveguides each forming an opening therethrough from the front side to the rear side, and passages substantially around the waveguides. The passages are configured to conduct cooling medium around the waveguides and between the front side and the rear side of the RF aperture coldplate.

Abstract: According to one embodiment of the present invention a method for biasing a power amplifier having at least one transistor exhibiting kink anomaly includes providing a bias circuit coupled to a gate of at least one transistor of the power amplifier. The method also includes providing, by the bias circuit, a bias voltage to the gate. The bias circuit has a load characteristic that intersects a current versus gate voltage curve for the gate at a frequency of operation of the power amplifier only once and that exhibits a low impedance at the intersection of the load characteristic with the current versus gate curve of the gate.

Abstract: A hybrid coupler (10, 90, 110, 130, 160, 210) includes a substrate (12) having a coupling structure formed thereon using thick film processing techniques. The coupling structure includes two parallel conductive strips (21, 31). One strip (21) is coupled at one end to an incident port (22) and at the other end to a direct port (23). The other strip (31) is coupled at one end to a coupled port (32) and at the other end to an isolated port (33). An electrically conductive shield (71, 91, 111, 164) is aligned with and enhances coupling between the conductive strips. A dielectric layer (61, 162) is provided between the shield and the conductive strips.