Abstract: Methods, systems, and computer-readable media for automated page generation using value-based recommendations are disclosed. A plurality of content recommendations are determined for a web page using one or more recommenders. Individual ones of the content recommendations are assigned to individual ones of a plurality of interaction elements. Respective effectiveness values for individual ones of the interaction elements are determined based at least in part on the individual ones of the content recommendations assigned to the individual ones of the interaction elements. Based at least in part on the respective effectiveness values for the individual ones of the interaction elements, individual ones of the interaction elements are assigned to respective portions of the web page. The web page is generated based at least in part on the individual ones of the interaction elements assigned to the respective portions of the web page.

Abstract: When testing network management applications, it is desirable to show that they will work with large or very large networks, to determine the upper bounds of the applications capabilities, and improvements which might increase the upper bounds. A method of testing a network application is disclosed mapping a layer-3 addresses of a real subnetwork onto a plurality of mapped layer-3 subnetwork addresses for conversations with applications or devices. Packets are modified to change a destination layer-3 address in a mapped subnetwork, pointing to corresponding real IP address and forwarding the packets. The conversation to which a response from a reallayer-3 address relates is identified. The source layer-3 address and packet contents are changed into the appropriate mapped subnetwork and the packet is forwarded to the application or device. An existing test network of any size may be used as the basis for testing the network management application.

Abstract: A micro-magnetic switch includes a permanent magnet and a supporting device having contacts coupled thereto and an embedded coil. The supporting device can be positioned proximate to the magnet. The switch also includes a cantilever coupled at a central point to the supporting device. The cantilever has a conducting material coupled proximate an end and on a side of the cantilever facing the supporting device and having a soft magnetic material coupled thereto. During thermal cycling the cantilever can freely expand based on being coupled at a central point to the supporting device, which substantially reduces coefficient of thermal expansion differences between the cantilever and the supporting device.

Abstract: Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.

Abstract: Radio frequency (RF) switch comprising an electromagnet formed on a magnet, a transmission line formed on the electromagnet and having a ground line and a signal line, and a movable contact connected to either the ground line or the signal line and capable of electrically coupling the ground line with the signal line. The transmission line is capable of propagating a RF signal if the ground line is electrically decoupled from the signal line. Conversely, the transmission line is incapable of propagating a RF signal if the ground line is electrically coupled with the signal line. The electromagnet can comprise an electromagnetic coil, formed in a layer of dielectric material, electrically coupled to a current source. Preferably, the movable contact is capable of being magnetically actuated, and is latchable. The magnet, the electromagnet, the transmission line, and the movable contact can have dimensions at a micron order of magnitude. The transmission line can be a coplanar waveguide.

Abstract: A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

Abstract: A micro-magnetic switch includes a permanent magnet and a supporting device having contacts coupled thereto and an embedded coil. The supporting device can be positioned proximate to the magnet. The switch also includes a cantilever coupled at a central point to the supporting device. The cantilever has a conducting material coupled proximate an end and on a side of the cantilever facing the supporting device and having a soft magnetic material coupled thereto. During thermal cycling the cantilever can freely expand based on being coupled at a central point to the supporting device, which substantially reduces coefficient of thermal expansion differences between the cantilever and the supporting device.

Abstract: A system and method are used to route input signals from an input node to N output nodes. The system includes an input section that receives input signals, an output section that transmits output signals based on the input signals, and a switching section. The switching section includes switches that control transmission of the input signals from the input section to the output section. The switches can be latching micro-magnetic switches that include a magnet proximate to a substrate, a cantilever coupled to the substrate and positioned proximate to the magnet, the cantilever coupled to a magnetic material, and a conductor coupled to the substrate, the conductor conducting a current that induces a first torque in the cantilever.

Abstract: Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.

Abstract: Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever.

Abstract: Radio frequency (RF) switch comprising an electromagnet formed on a magnet, a transmission line formed on the electromagnet and having a ground line and a signal line, and a movable contact connected to either the ground line or the signal line and capable of electrically coupling the ground line with the signal line. The transmission line is capable of propagating a RF signal if the ground line is electrically decoupled from the signal line. Conversely, the transmission line is incapable of propagating a RF signal if the ground line is electrically coupled with the signal line. The electromagnet can comprise an electromagnetic coil, formed in a layer of dielectric material, electrically coupled to a current source. Preferably, the movable contact is capable of being magnetically actuated, and is latchable. The magnet, the electromagnet, the transmission line, and the movable contact can have dimensions at a micron order of magnitude. The transmission line can be a coplanar waveguide.

Abstract: A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

Abstract: Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.

Abstract: Micro magnetic switching apparatus includes a permanent magnet supported on a base and a coil supported by the base so as to define a plurality of sides. A plurality of latching micro magnetic relays each includes a magnetic cantilever positioned to open a first electric circuit in a first orientation and to close the first electric circuit in a second orientation. One each of the relays is mounted adjacent each of the plurality of sides of the coil and adjacent the permanent magnet so as to be latched in one of the first and second orientations when the coil is not activated and to switch to the other of the first and second orientations when the coil is activated and to be latched in the other of the first and second orientations by the permanent magnet.

Abstract: A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

Abstract: A micro-magnetic switch includes a permanent magnet and a supporting device having contacts coupled thereto and an embedded coil. The supporting device can be positioned proximate to the magnet. The switch also includes a cantilever coupled at a central point to the supporting device. The cantilever has a conducting material coupled proximate an end and on a side of the cantilever facing the supporting device and having a soft magnetic material coupled thereto. During thermal cycling the cantilever can freely expand based on being coupled at a central point to the supporting device, which substantially reduces coefficient of thermal expansion differences between the cantilever and the supporting device.

Abstract: A system and method are used to route input signals from an input node to N output nodes. The system includes an input section that receives input signals, an output section that transmits output signals based on the input signals, and a switching section. The switching section includes switches that control transmission of the input signals from the input section to the output section.

Abstract: A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

Abstract: Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever.

Abstract: A field emission device (100) includes a cathode (110) and a ballast resistor (112) connected to cathode (110). Ballast resistor (112) includes a thin metallic layer (113) and a protective layer (114) disposed on metallic layer (113). Metallic layer (113) is made from chromium and has a thickness of about 40 angstroms. Protective layer (114) is made from sputtered silicon and has a thickness of about 500 angstroms. A portion of metallic layer (113) makes physical contact with cathode (110) and is sandwiched between cathode (110) and protective layer (114). Protective layer (114) is positioned to shield metallic layer (113) from high transient voltages.