Abstract: Location apparatus for making saw cuts in workpieces has a saw guide and support means for a workpiece to set a side face of the workpiece at predetermined positions to the saw guide. In various forms of the apparatus, said positions are angularly adjustable in horizontal and/or vertical planes. Means are also described for setting the workpiece to a predetermined location transversely of the sawing plane defined by said saw guide.

Abstract: A sawing location apparatus adapted to be placed on a workpiece has a bearing engagement for the workpiece to one side of a saw guide device and a location device on the other side of the saw guide device for setting the workpiece to a desired position in a direction transverse to the cutting plane defined by the saw guide device. Arrangements are described for making right-angled and oblique transverse cuts in an elongate workpiece as well as longitudinally directed cuts in an end face of such a workpiece.