Abstract: A system for glass substrate inspection, such as flat patterned media, includes an air table that holds the glass substrate. The air table includes chucks that emit gas as air bearings. A camera is disposed over the air table and moves in a direction across a width of a top surface of the glass substrate. An assembly includes a gripper and a probe bar configured to be transported under the camera. The gripper is configured to grip a bottom surface of the glass substrate opposite the top surface. The probe bar delivers driving signals to the glass substrate through a plurality of probe pins.

Abstract: A system for glass substrate inspection, such as flat patterned media, includes an air table that holds the glass substrate. The air table includes chucklets that emit gas as air bearings. A camera is disposed over the air table and moves in a direction across a width of a top surface of the glass substrate. An assembly includes a gripper and a probe bar configured to be transported under the camera. The gripper is configured to grip a bottom surface of the glass substrate opposite the top surface. The probe bar delivers driving signals to the glass substrate through a plurality of probe pins.

Abstract: A probe system for facilitating inspection of a device under test comprising a plurality of panels, the probe system incorporating: a configurable universal probe bar comprising a plurality of probe blocks, the plurality of probe blocks comprising a plurality of probe pins positioned to simultaneously electrically engage a plurality of cell contact pads of the plurality of panels of the device under test to deliver a plurality of electrical test signals; and an alignment system configured to achieve an alignment of the plurality of probe pins with the plurality of the cell contact pads of the plurality of panels of the device under test.

Abstract: A probe system for facilitating inspection of a device under test comprising a plurality of panels, the probe system incorporating: a configurable universal probe bar comprising a plurality of probe blocks, the plurality of probe blocks comprising a plurality of probe pins positioned to simultaneously electrically engage a plurality of cell contact pads of the plurality of panels of the device under test to deliver a plurality of electrical test signals; and an alignment system configured to achieve an alignment of the plurality of probe pins with the plurality of the cell contact pads of the plurality of panels of the device under test.

Abstract: Systems, assemblies and methods for thermally managing a grazing incidence collector (GIC) for EUV lithography applications are disclosed. The GIC thermal management assembly includes a GIC mirror shell interfaced with a jacket to form a sealed chamber. An open cell, heat transfer (OCHT) material is disposed within the metal chamber and is thermally and mechanically bonded with the GIC mirror shell and jacket. A coolant is flowed in an azimuthally symmetric fashion through the OCHT material between input and output plenums to effectuate cooling when the GIC thermal management assembly is used in a GIC mirror system configured to receive and form collected EUV radiation from an EUV radiation source.

Abstract: A stress-decoupling device and methods of using same in a cooled grazing-incidence collector (GIC) mirror system are disclosed. A method includes providing a cooled GIC shell, providing input and output primary cooling-fluid manifolds, and fluidly connecting the cooled GIC shell to the input and output primary cooling-fluid manifolds through respective stress-decoupling devices. An exemplary stress-decoupling device includes inner and outer bellows that define a sealed cavity filled with a gas. An expansion-limiting member within the sealed cavity limits the expansion of the inner bellows due to the pressure of the cooling fluid flowing therethrough. The stress-decoupling device reduces or prevents the communication of stress from parts of the GIC mirror system to the GIC shells. Stress-decoupling systems and methods for a cooled spider as used in a GIC mirror system are also disclosed.

Abstract: Systems, assemblies and methods for thermally managing a grazing incidence collector (GIC) for EUV lithography applications are disclosed. The GIC thermal management assembly includes a GIC mirror shell interfaced with a jacket to form a sealed chamber. An open cell, heat transfer (OCHT) material is disposed within the metal chamber and is thermally and mechanically bonded with the GIC mirror shell and jacket. A coolant is flowed in an azimuthally symmetric fashion through the OCHT material between input and output plenums to effectuate cooling when the GIC thermal management assembly is used in a GIC mirror system configured to receive and form collected EUV radiation from an EUV radiation source.

Abstract: A stress-decoupling device and methods of using same in a cooled grazing-incidence collector (GIC) mirror system are disclosed. A method includes providing a cooled GIC shell, providing input and output primary cooling-fluid manifolds, and fluidly connecting the cooled GIC shell to the input and output primary cooling-fluid manifolds through respective stress-decoupling devices. An exemplary stress-decoupling device includes inner and outer bellows that define a sealed cavity filled with a gas. An expansion-limiting member within the sealed cavity limits the expansion of the inner bellows due to the pressure of the cooling fluid flowing therethrough. The stress-decoupling device reduces or prevents the communication of stress from parts of the GIC mirror system to the GIC shells. Stress-decoupling systems and methods for a cooled spider as used in a GIC mirror system are also disclosed.