Patents by Inventor Goro HAMAMOTO

Goro HAMAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240080979
    Abstract: There is provided a printed wiring board including an outermost conductive layer that includes a plurality of conductive pads, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the first conductive layer, a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other, a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other, and a stitching via that is connected to a ground. The first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads are arranged.
    Type: Application
    Filed: July 19, 2023
    Publication date: March 7, 2024
    Inventors: Goro HAMAMOTO, Keisuke YAMAMOTO, Yutaka UEMATSU, Shinsuke ONOE, Yohei OSHIMA
  • Patent number: 11612055
    Abstract: In a printed wiring board, one transmitting circuit and N (N is an integer of 3 or more) receiving circuits are coupled by a multi-point wiring. First to N-th branch points are provided in sequence in the multi-point wiring having one end coupled to the transmitting circuit. Wirings branched at the respective branch points are coupled to the respective receiving circuits. Here, a wiring length from a coupling point of the transmitting circuit to a first branch point is configured to be longer than a wiring length from the first branch point to the second branch point. Wiring lengths between the adjacent branch points at and after a second branch point are configured to be shorter than the wiring length from the first branch point to the second branch point.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: March 21, 2023
    Assignee: HITACHI, LTD.
    Inventors: Goro Hamamoto, Yutaka Uematsu, Yohei Oshima, Maya Hyakudomi
  • Patent number: 11545978
    Abstract: Main wiring including a plurality of differential transmission lines for transmitting differential signals is formed on a motherboard. Termination resistors, provided at both ends of each of the plurality of differential transmission lines, connect the plurality of differential transmission lines to each other. A plurality of daughter boards are connected in parallel to each other via the main wiring. A line characteristic impedance of each differential transmission line is higher than a termination resistance value, which is a resistance value of the termination resistor.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: January 3, 2023
    Assignee: HITACHI, LTD.
    Inventors: Goro Hamamoto, Tatsuyuki Ootani, Yutaka Uematsu, Jouji Matsushita
  • Patent number: 11528045
    Abstract: A signal transmission device has a multi-point wiring structure in which termination resistors are mounted on both ends of a cable, and a plurality of PCBs connected to the cable transmit a signal through the cable. The PCB of a host node includes: a connector connected to the cable; a transformer unit that is connected to the connector via a first PCB transmission line and insulates the connector; an RS 485 transceiver that is connected to the transformer unit via a second PCB transmission line and transmits the signal to the PCB of another node or receives the signal from the PCB of another node; and AC termination that is provided in at least one of the first PCB transmission line and the second PCB transmission line and suppresses resonance and antiresonance in a reflection frequency characteristic of noise.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: December 13, 2022
    Assignee: HITACHI, LTD.
    Inventors: Goro Hamamoto, Yutaka Uematsu, Masahiro Shiraishi, Tatsuyuki Ootani
  • Publication number: 20220182057
    Abstract: Main wiring including a plurality of differential transmission lines for transmitting differential signals is formed on a motherboard. Termination resistors, provided at both ends of each of the plurality of differential transmission lines, connect the plurality of differential transmission lines to each other. A plurality of daughter boards are connected in parallel to each other via the main wiring. A line characteristic impedance of each differential transmission line is higher than a termination resistance value, which is a resistance value of the termination resistor.
    Type: Application
    Filed: October 26, 2021
    Publication date: June 9, 2022
    Inventors: Goro HAMAMOTO, Tatsuyuki OOTANI, Yutaka UEMATSU, Jouji MATSUSHITA
  • Publication number: 20220182086
    Abstract: A signal transmission device has a multi-point wiring structure in which termination resistors are mounted on both ends of a cable, and a plurality of PCBs connected to the cable transmit a signal through the cable. The PCB of a host node includes: a connector connected to the cable; a transformer unit that is connected to the connector via a first PCB transmission line and insulates the connector; an RS 485 transceiver that is connected to the transformer unit via a second PCB transmission line and transmits the signal to the PCB of another node or receives the signal from the PCB of another node; and AC termination that is provided in at least one of the first PCB transmission line and the second PCB transmission line and suppresses resonance and antiresonance in a reflection frequency characteristic of noise.
    Type: Application
    Filed: October 29, 2021
    Publication date: June 9, 2022
    Inventors: Goro HAMAMOTO, Yutaka UEMATSU, Masahiro SHIRAISHI, Tatsuyuki OOTANI