Abstract: A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon--carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.

Abstract: A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.

Abstract: A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process whereafter and during the wafer polishing process. After irradiation, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.

Abstract: The present invention relates to a composite tubular article for use as the fixing belt in an image-forming device such as a copying machine etc., particularly as a fixing belt suited for thermal fixing, and also relates to a process for producing the same.Conventionally known as an image-fixing belt is a belt consisting of a polyimide resin as the inner layer and a fluoroplastic as the outer layer. However, this fixing belt has problems that clear images cannot be obtained because the thickness of each layer is uneven, and that unglossed, so-called matt images cannot be obtained because the belt surface is smooth.This invention provides a composite tubular article comprising a tubular inner layer made of a polyimide resin and a tubular outer layer made of a fluoroplastic, the outer circumferential surface of the fluoroplastic tubular outer layer having a surface roughness of 1 to 10 .mu.m.

Abstract: An adhesive film comprising a ceramic powder and an adhesive composition having pressure-sensitive properties at room temperature (20.degree. C.), and a process for producing a multilayered ceramic structure, such as multilayered ceramic substrates, laminated ceramic capacitors, etc. using the adhesive film, are disclosed.