Abstract: A connector comprises a housing, a terminal and a shell. The terminal has a held portion held by the housing, a first portion extending rearward from the held portion and a second portion extending forward from the held portion. The first portion has a connectable portion configured to be connected to a first object. The second portion has a resiliently deformable support portion and a contact portion supported by the support portion. The contact portion is pressed against a second object when the connector is fixed on the second object. The shell has a first upper plate and a second upper plate which is located below the first upper plate. The first upper plate covers the first portion of the terminal from above. The second upper plate covers the second portion of the terminal from above.

Abstract: Ina connector with substrate, a compression connector pressed against and connected to a connection target object and a substrate are attached via a cage. The connector with substrate includes a substrate; a cage fixed to the substrate; and a compression connector inserted into the cage and including contacts that are in contact with the substrate, a housing to which the contacts are fixed, and a cover shell that covers an upper surface portion of the housing. One of the cage and the compression connector includes a lock hole and another of the cage and the compression connector includes a lock piece that enters the lock hole to fix a position of the compression connector with respect to the cage, or the cage or the compression connector includes the lock hole and the lock piece.

Abstract: A compression connector is fixed to a substrate with a small motion. In a connector with substrate, a compression connector pressed against and connected to a connection target object and a substrate are attached. The connector with substrate includes a substrate including a hole; and a compression connector disposed on the substrate and including contacts that are in contact with the substrate, a housing to which the contacts are fixed, and a cover shell that has a top surface disposed in parallel to the substrate and a vertical surface vertically extending to the substrate from the top surface, and that covers an upper surface portion of the housing. The vertical surface includes at least one fixing part at a substrate side, piercing through the hole formed in the substrate, and functioning as slip-off prevention for the compression corrector with respect to the substrate.

Abstract: The present disclosure relates to an image sensor and an electronic device that can reduce occurrence of a problem not only in a case of adding and using outputs of a plurality of PDs that share one of on-chip lenses but also in a case of using them individually. An image sensor according to a first aspect of the present disclosure includes: a light receiving element that generates charges by photoelectric conversion; an on-chip lens that is shared by a plurality of light receiving elements and condenses incident light onto the plurality of light receiving elements; and an AD convertor that converts charges generated by the light receiving element to a digital signal. Exposure timings of the plurality of light receiving elements sharing one of the on-chip lenses are the same. The present disclosure can be applied, for example, to image pickup devices having an image-plane phase-difference detection AF function.

Abstract: The present disclosure relates to an image sensor and an electronic device that can reduce occurrence of a problem not only in a case of adding and using outputs of a plurality of PDs that share one of on-chip lenses but also in a case of using them individually. An image sensor according to a first aspect of the present disclosure includes: a light receiving element that generates charges by photoelectric conversion; an on-chip lens that is shared by a plurality of light receiving elements and condenses incident light onto the plurality of light receiving elements; and an AD convertor that converts charges generated by the light receiving element to a digital signal. Exposure timings of the plurality of light receiving elements sharing one of the on-chip lenses are the same. The present disclosure can be applied, for example, to image pickup devices having an image-plane phase-difference detection AF function.