Patents by Inventor Gottfried Ferber
Gottfried Ferber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7944033Abstract: An apparatus includes a housing with a plurality of restraining elements and at least one supporting element. A cover is elastically deformed by the plurality of restraining elements and the at least one supporting means. At least one substrate carrying at least one semiconductor chip is provided within the housing.Type: GrantFiled: October 18, 2007Date of Patent: May 17, 2011Assignee: Infineon Technologies AGInventors: Benedikt Specht, Gottfried Ferber
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Patent number: 7851267Abstract: A method for assembling a power module includes providing a casing with a plurality of receiving elements. At least one substrate carrying at least one semiconductor chip is provided within the casing. At least one support element is provided. An elastically stressed cover is arranged over the at least one support element, and the cover is released so that the elastically stressed cover is restrained by the at least one support element and the plurality of receiving elements.Type: GrantFiled: October 18, 2007Date of Patent: December 14, 2010Assignee: Infineon Technologies AGInventors: Benedikt Specht, Gottfried Ferber
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Publication number: 20090104734Abstract: A method for assembling a power module includes providing a casing with a plurality of receiving elements. At least one substrate carrying at least one semiconductor chip is provided within the casing. At least one support element is provided. An elastically stressed cover is arranged over the at least one support element, and the cover is released so that the elastically stressed cover is restrained by the at least one support element and the plurality of receiving elements.Type: ApplicationFiled: October 18, 2007Publication date: April 23, 2009Applicant: Infineon Technologies AGInventors: Benedikt Specht, Gottfried Ferber
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Publication number: 20090102040Abstract: An apparatus includes a housing with a plurality of restraining elements and at least one supporting element. A cover is elastically deformed by the plurality of restraining elements and the at least one supporting means. At least one substrate carrying at least one semiconductor chip is provided within the housing.Type: ApplicationFiled: October 18, 2007Publication date: April 23, 2009Applicant: Infineon Technologies AGInventors: Benedikt Specht, Gottfried Ferber
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Publication number: 20060272797Abstract: A cooling device has a cooling element (3) and a pressing device (4) which presses the component (1) against the cooling element (3). The pressing device (4) is resilient and is connected to the cooling element in a positive fit in order to produce fixing means which fix the component (1) to the cooling element in a reliable manner, the fixing means being easy to produce and compact.Type: ApplicationFiled: May 17, 2006Publication date: December 7, 2006Inventors: Gottfried Ferber, Benedikt Specht
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Publication number: 20060226531Abstract: A semiconductor power module has a support (1), whereon are formed conductor strips (5, 6, 7, 8) by applying a structure on an electrically conductive layer (3) applied on one side (2) of the support. A semiconductor power module can be manufactured easily and economically enabling several mounting technologies by using a homogeneous base support. Therefore, the conductor strips (5, 6, 7, 8), as integral elements of the conductor circuit have loose ends (6a, 7a, 8a) detached from the side (2) of the support, the ends of the conductor strips extending outside the support (1) and forming external connections.Type: ApplicationFiled: January 11, 2006Publication date: October 12, 2006Inventors: Thomas Passe, Gottfried Ferber, Benedikt Specht
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Patent number: 6858807Abstract: A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening zone to be connected to a contact element that is to be provided. The fastening zone is fixed on the carrier substrate with a first section. A second section projects from the plane of the carrier substrate, and the first and the second sections are adapted to be electrically and mechanically connected to the contact element.Type: GrantFiled: December 2, 2002Date of Patent: February 22, 2005Assignee: EUPEC Europaeische Gesellschaft fuer Leistungshalbleiter mbHInventors: Gottfried Ferber, Reimund Pelmer
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Patent number: 6853088Abstract: A semiconductor module and a method for its fabrication are described. The semiconductor module has at least one semiconductor component that is disposed directly on a substrate body. The substrate body has an insulating ceramic provided with a metal layer. At least one connection conductor is joined to the metal layer by welding, in particular laser microwelding.Type: GrantFiled: January 24, 2002Date of Patent: February 8, 2005Assignee: EUPEC GmbHInventors: Gottfried Ferber, Reimund Pelmer
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Patent number: 6828600Abstract: A power semiconductor module is presented in which terminal elements are press-fitted into openings in a plastic housing. This measure improves the reliability of the internal bonds between the substrate and the terminal element since there is no longer a risk of the terminal elements loosening in the plastic housing.Type: GrantFiled: May 5, 2003Date of Patent: December 7, 2004Assignee: eupec Europaeische Gesellschaft fuer Leistungshalbleiter mbHInventors: Andreas Lenniger, Gottfried Ferber, Alfred Kemper
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Publication number: 20030168724Abstract: A power semiconductor module is presented in which terminal elements are press-fitted into openings in a plastic housing. This measure improves the reliability of the internal bonds between the substrate and the terminal element since there is no longer a risk of the terminal elements loosening in the plastic housing.Type: ApplicationFiled: May 5, 2003Publication date: September 11, 2003Applicant: Siemens AGInventors: Andreas Lenniger, Gottfried Ferber, Alfred Kemper
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Patent number: 6597585Abstract: A power semiconductor module includes a plastic housing, a plurality of connection elements for external main connections and control connections, and at least one ceramic substrate which is provided at least on its top side with a structured metalization. The at least one ceramic substrate is fitted with semiconductor components and is inserted into a bottom opening of the plastic housing. The connection elements for the external main connections and control connections are connected by detaching a part of the structured metalization from the at least one ceramic substrate and bending it vertically upward to form a grip tab so that the grip tab can be connected to a connection element through the use of a brazed joint or a welded joint. These measures ensure an excellent stability with regard to fluctuating thermal loads.Type: GrantFiled: September 17, 2001Date of Patent: July 22, 2003Assignee: Eupec Europaeische Gesellschaft fuer Leistungshalbleiter GmbH & Co. KGInventors: Gottfried Ferber, Reimund Pelmer
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Publication number: 20030110627Abstract: A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening zone to be connected to a contact element that is to be provided. The fastening zone is fixed on the carrier substrate with a first section. A second section projects from the plane of the carrier substrate, and the first and the second sections are adapted to be electrically and mechanically connected to the contact element.Type: ApplicationFiled: December 2, 2002Publication date: June 19, 2003Inventors: Gottfried Ferber, Reimund Pelmer
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Publication number: 20020105075Abstract: A semiconductor module and a method for its fabrication are described. The semiconductor module has at least one semiconductor component that is disposed directly on a substrate body. The substrate body has an insulating ceramic provided with a metal layer. At least one connection conductor is joined to the metal layer by welding, in particular laser microwelding.Type: ApplicationFiled: January 24, 2002Publication date: August 8, 2002Inventors: Gottfried Ferber, Reimund Pelmer
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Publication number: 20020033529Abstract: A power semiconductor module includes a plastic housing, a plurality of connection elements for external main connections and control connections, and at least one ceramic substrate which is provided at least on its top side with a structured metalization. The at least one ceramic substrate is fitted with semiconductor components and is inserted into a bottom opening of the plastic housing. The connection elements for the external main connections and control connections are connected by detaching a part of the structured metalization from the at least one ceramic substrate and bending it vertically upward to form a grip tab so that the grip tab can be connected to a connection element through the use of a brazed joint or a welded joint. These measures ensure an excellent stability with regard to fluctuating thermal loads.Type: ApplicationFiled: September 17, 2001Publication date: March 21, 2002Inventors: Gottfried Ferber, Reimund Pelmer