Patents by Inventor Gousuke Takahashi

Gousuke Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof
    Patent number: 7808086
    Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: October 5, 2010
    Assignees: NEC Electronics Corporation, Hitachi Cable Precision Co., Ltd.
    Inventors: Akimi Saiki, Hiroyuki Shoji, Gousuke Takahashi, Noriyuki Hasegawa, Fumio Takano, Kouji Sato
  • LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
    Publication number: 20080296746
    Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
    Type: Application
    Filed: May 29, 2008
    Publication date: December 4, 2008
    Applicants: NEC ELECTRONICS CORPORATION, HITACHI CABLE PRECISION CO., LTD.
    Inventors: Akimi SAIKI, Hiroyuki SHOJI, Gousuke TAKAHASHI, Noriyuki HASEGAWA, Fumio TAKANO, Kouji SATO