Patents by Inventor Govind Saraswat

Govind Saraswat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for determining circuit failure rate
    Patent number: 10599808
    Abstract: A method involves determining failure in time rate for a circuit. The method may include obtaining circuit data regarding a circuit. The circuit may include a first wire segment and a second wire segment. The method may further include obtaining reliability data. The reliability data may describe a failure of the circuit over a pre-determined time period. The method may further include obtaining a thermal map. The method may further include determining a first failure rate for the first wire segment of the circuit. The first failure rate may be a probability that the first wire segment fails in a predetermined amount of time. The method may further include determining a second failure rate for the second wire segment of the circuit. The method may further include generating a model of the circuit. The model of the circuit may describe the first and the second failure rate of the circuit.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: March 24, 2020
    Assignee: Oracle International Corporation
    Inventors: Govind Saraswat, Wai Chung William Au, Douglas Stanley, Anuj Trivedi
  • Method and System for Determining Circuit Failure Rate
    Publication number: 20190258773
    Abstract: A method involves determining failure in time rate for a circuit. The method may include obtaining circuit data regarding a circuit. The circuit may include a first wire segment and a second wire segment. The method may further include obtaining reliability data. The reliability data may describe a failure of the circuit over a pre-determined time period. The method may further include obtaining a thermal map. The method may further include determining a first failure rate for the first wire segment of the circuit. The first failure rate may be a probability that the first wire segment fails in a predetermined amount of time. The method may further include determining a second failure rate for the second wire segment of the circuit. The method may further include generating a model of the circuit. The model of the circuit may describe the first and the second failure rate of the circuit.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Inventors: Govind Saraswat, Wait Chung Williams Au, Douglas Stanley, Anuj Trivedi
  • Method and system for determining circuit failure rate
    Patent number: 10282507
    Abstract: A method involves determining failure in time rate for a circuit. The method may include obtaining circuit data regarding a circuit. The circuit may include a first wire segment and a second wire segment. The method may further include obtaining reliability data. The reliability data may describe a failure of the circuit over a pre-determined time period. The method may further include obtaining a thermal map. The method may further include determining a first failure rate for the first wire segment of the circuit. The first failure rate may be a probability that the first wire segment fails in a predetermined amount of time. The method may further include determining a second failure rate for the second wire segment of the circuit. The method may further include generating a model of the circuit. The model of the circuit may describe the first and the second failure rate of the circuit.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: May 7, 2019
    Assignee: Oracle International Corporation
    Inventors: Govind Saraswat, Wai Chung William Au, Douglas Stanley, Anuj Trivedi
  • METHOD AND SYSTEM FOR DETERMINING CIRCUIT FAILURE RATE
    Publication number: 20170147738
    Abstract: A method involves determining failure in time rate for a circuit. The method may include obtaining circuit data regarding a circuit. The circuit may include a first wire segment and a second wire segment. The method may further include obtaining reliability data. The reliability data may describe a failure of the circuit over a pre-determined time period. The method may further include obtaining a thermal map. The method may further include determining a first failure rate for the first wire segment of the circuit. The first failure rate may be a probability that the first wire segment fails in a predetermined amount of time. The method may further include determining a second failure rate for the second wire segment of the circuit. The method may further include generating a model of the circuit. The model of the circuit may describe the first and the second failure rate of the circuit.
    Type: Application
    Filed: November 24, 2015
    Publication date: May 25, 2017
    Inventors: Govind Saraswat, Wai Chung William Au, Douglas Stanley, Anuj Trivedi