Abstract: A pelletized road marking composition includes a binder mixture, a filler mixture and bentonite clay. The binder mixture includes at least one alkyd ester, at least one wax, at least one ethylene copolymer, and at least one plasticizer. The filler mixture includes at least one coloring additive, reflective elements, and at least one inert inorganic filler. The components of the road marking composition are mixed and melted and processed into pellets. The bentonite clay added to the composition prevents the pellets from clumping when stored at elevated temperatures.

Abstract: A retroreflective optical element is provided in which modified glass beads having a high refractive index are embedded on the surface of a thermoplastic core. The glass beads are heated to a temperature near the softening point of the thermoplastic core and the heated beads and thermoplastic cores are mixed in a fluidized bed. The beads embed into the thermoplastic core and are also chemically bonded thereto through a silane coupling agent provided on the beads.

Abstract: A pelletized road marking composition includes a binder mixture, a filler mixture and bentonite clay. The binder mixture includes at least one alkyd ester, at least one wax, at least one ethylene copolymer, and at least one plasticizer. The filler mixture includes at least one coloring additive, reflective elements, and at least one inert inorganic filler. The components of the road marking composition are mixed and melted and processed into pellets. The bentonite clay added to the composition prevents the pellets from clumping when stored at elevated temperatures.

Abstract: A masterbatch composition of elastomer and from 20 to 100 parts per hundred parts elastomer of fibrous micropulp wherein the micropulp has fibers with a volume weighted average fiber length of from 20 to 200 micrometers as measured by laser diffraction, a relative specific surface area of from 30 to 600 square meter per gram as measured by nuclear magnetic resonance and the fibers selected from the group consisting of aromatic polyamide, aromatic copolyamide, polyacrylonitrile and polyazole.

Abstract: Provided is a film having a thickness of less than 500 ?m comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.

Abstract: Provided are processes for making multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film.

Abstract: Disclosed are curable epoxy compositions comprising imidazolium monocarboxylate salts as curing catalysts and method for curing same. The imidazolium monocarboxylate salt is suitable for use as latent catalysts that effect curing upon heating to a curing temperature threshold. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards. Of particular utility are curable compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts.

Abstract: Provided is a multi-layer article comprising an electrically conductive metal layer adheringly contacting the surface of a polymeric composite film less than 500 ?m in thickness, having a surface, the polymeric composite film comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. A process of film casting onto a conductive metal layer is provided.

Abstract: Provided is a composite comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. Suitable polymers include polyimide and epoxy. A process is also provided. The surface modified hexagonal boron nitride particles comprise surface-bonded substituted phenyl radicals.

Abstract: Provided is a composition comprising hexagonal boron nitride particles having a surface and a substituted phenyl radical bonded to the surface, the substituted phenyl radical being represented by the structure: where X is a radical selected from NH2—, HO—, R2OC(O)—, R2C(O)O—, HSO3—, NH2CO—, halogens, alkyl or aryl, including substituted aryl; where R1 is hydrogen, alkyl or alkoxy, and R2 is hydrogen, alkyl or aryl, including substituted aryl. A process for preparing the composition is also provided.

Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.

Abstract: Provided is a composition comprising hexagonal boron nitride particles having a surface and a substituted phenyl radical bonded to the surface, the substituted phenyl radical being represented by the structure: where X is a radical selected from NH2—, HO—, R2OC(O)—, R2C(O)O—, HSO3—, NH2CO—, halogens, alkyl or aryl, including substituted aryl; where R1 is hydrogen, alkyl or alkoxy, and R2 is hydrogen, alkyl or aryl, including substituted aryl. A process for preparing the composition is also provided.

Abstract: Provided is a multi-layer article comprising an electrically conductive metal layer adheringly contacting the surface of a polymeric composite film less than 500 ?m in thickness, having a surface, the polymeric composite film comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. A process of film casting onto a conductive metal layer is provided.

Abstract: Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.

Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.

Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.

Abstract: Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes.

Abstract: Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.

Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.

Abstract: Provided according to the invention are cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyimide cross-links, providing a polymeric composite on a molecular scale, and shaped articles made therefrom. In some embodiments the shaped articles are particularly well suited for electronics applications. The shaped articles are characterized by low CTE (coefficient of thermal expansion), low dielectric constant (Dk), low dissipation factor (Df), high strength, high modulus and high toughness.