Patents by Inventor Govindasamy Paramasivan Rajendran

Govindasamy Paramasivan Rajendran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITE OF A POLYMER AND SURFACE MODIFIED HEXAGONAL BORON NITRIDE PARTICLES
    Publication number: 20100288968
    Abstract: Provided is a composite comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. Suitable polymers include polyimide and epoxy. A process is also provided.
    Type: Application
    Filed: May 13, 2009
    Publication date: November 18, 2010
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Pui-Yan Lin, Govindasamy Paramasivan Rajendran, George Elias Zahr
  • FILM PREPARED FROM A CASTING COMPOSITION COMPRISING A POLYMER AND SURFACE MODIFIED HEXAGONAL BORON NITRIDE PARTICLES
    Publication number: 20100291365
    Abstract: Provided is a film having a thickness of less than 500 ?m comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.
    Type: Application
    Filed: May 13, 2009
    Publication date: November 18, 2010
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Pui-Yan Lin, Govindasamy Paramasivan Rajendran, George Elias Zahr
  • Low loss dielectric material for printed circuit boards and integrated circuit chip packaging
    Patent number: 6890635
    Abstract: Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: May 10, 2005
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Pui-Yan Lin, Govindasamy Paramasivan Rajendran, George Elias Zahr
  • Process for crystallizing at least a portion of a crystallizable condensation homopolymer to form solid particles
    Patent number: 6835335
    Abstract: A process for forming solid particles comprising the steps of: combining in molten form a major component of a crystallizable condensation homopolymer and a minor component of a non-crystallizable condensation polymer, wherein the crystallizable condensation homopolymer and the non-crystallizable condensation polymer each have a degree of polymerization of 10 to less than 48 prior to the combining; mixing the combined crystallizable condensation homopolymer and non-crystallizable condensation polymer in molten form to form a mixture that comprises 10 to 30 mol % of the non-crystallizable condensation polymer; forming the mixture into droplets; exposing the droplets to a thermal environment which results in the bulk of the droplet reaching within 15 seconds a temperature within ±10° C.
    Type: Grant
    Filed: May 17, 2002
    Date of Patent: December 28, 2004
    Assignee: Invista North America S.รก.r.l.
    Inventors: Vivek Kapur, Govindasamy Paramasivan Rajendran, Kenneth Wayne Leffew
  • Low loss dielectric material for printed circuit boards and integrated circuit chip packaging
    Publication number: 20040009727
    Abstract: Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.
    Type: Application
    Filed: April 25, 2003
    Publication date: January 15, 2004
    Inventors: Pui-Yan Lin, Govindasamy Paramasivan Rajendran, George Elias Zahr
  • Process for crystallizing at least a portion of a crystallizable condensation homopolymer to form solid particles
    Publication number: 20030222363
    Abstract: A process for forming solid particles comprising the steps of: combining in molten form a major component of a crystallizable condensation homopolymer and a minor component of a non-crystallizable condensation polymer, wherein the crystallizable condensation homopolymer and the non-crystallizable condensation polymer each have a degree of polymerization of 10 to less than 48 prior to the combining; mixing the combined crystallizable condensation homopolymer and non-crystallizable condensation polymer in molten form to form a mixture that comprises 10 to 30 mol % of the non-crystallizable condensation polymer; forming the mixture into droplets; exposing the droplets to a thermal environment which results in the bulk of the droplet reaching within 15 seconds a temperature within ±10° C.
    Type: Application
    Filed: May 17, 2002
    Publication date: December 4, 2003
    Inventors: Vivek Kapur, Govindasamy Paramasivan Rajendran, Kenneth Wayne Leffew