Abstract: A solar cell module includes interconnected solar cells, a transparent cover over the front sides of the solar cells, and a backsheet on the backsides of the solar cells. The solar cell module includes an electrical insulator between the transparent cover and the front sides of the solar cells. An encapsulant protectively packages the solar cells. To prevent polarization, the insulator has resistance suitable to prevent charge from leaking from the front sides of the solar cells to other portions of the solar cell module by way of the transparent cover. The insulator may be attached (e.g., by coating) directly on an underside of the transparent cover or be a separate layer formed between layers of the encapsulant. The solar cells may be back junction solar cells.

Abstract: The inventors of the present disclosure recognized that elimination or reduction of the silver paste and/or silver busbars on the front and/or rear surfaces of solar cells and solar modules would advantageously lower the total cost of the solar cell and/or solar module. The inventors of the present disclosure recognized that the silver paste on the front and rear surface of solar cells or solar modules can be eliminated or the amount of silver paste reduced by replacing the silver busbars with a solderable tape including a conductive metal foil and a nonconductive adhesive.

Abstract: A solar cell module includes interconnected solar cells, a transparent cover over the front sides of the solar cells, and a backsheet on the backsides of the solar cells. The solar cell module includes an electrical insulator between the transparent cover and the front sides of the solar cells. An encapsulant protectively packages the solar cells. To prevent polarization, the insulator has resistance suitable to prevent charge from leaking from the front sides of the solar cells to other portions of the solar cell module by way of the transparent cover. The insulator may be attached (e.g., by coating) directly on an underside of the transparent cover or be a separate layer formed between layers of the encapsulant. The solar cells may be back junction solar cells.

Abstract: Photovoltaic modules with adhesion promoters and methods for fabricating photovoltaic modules with adhesion promoters are described. A photovoltaic module includes a solar cell including a first surface and a second surface, the second surface including a plurality of interspaced back-side contacts. A first glass layer is coupled to the first surface by a first encapsulating layer. A second glass layer is coupled to the second surface by a second encapsulating layer. At least a portion of the second encapsulating layer is bonded directly to the plurality of interspaced back-side contacts by an adhesion promoter.

Abstract: A solar cell module includes interconnected solar cells, a transparent cover over the front sides of the solar cells, and a backsheet on the backsides of the solar cells. The solar cell module includes an electrical insulator between the transparent cover and the front sides of the solar cells. An encapsulant protectively packages the solar cells. To prevent polarization, the insulator has resistance suitable to prevent charge from leaking from the front sides of the solar cells to other portions of the solar cell module by way of the transparent cover. The insulator may be attached (e.g., by coating) directly on an underside of the transparent cover or be a separate layer formed between layers of the encapsulant. The solar cells may be back junction solar cells.

Abstract: Photovoltaic modules with adhesion promoters and methods for fabricating photovoltaic modules with adhesion promoters are described. A photovoltaic module includes a solar cell including a first surface and a second surface, the second surface including a plurality of interspaced back-side contacts. A first glass layer is coupled to the first surface by a first encapsulating layer. A second glass layer is coupled to the second surface by a second encapsulating layer. At least a portion of the second encapsulating layer is bonded directly to the plurality of interspaced back-side contacts by an adhesion promoter.

Abstract: A solar cell module includes interconnected solar cells, a transparent cover over the front sides of the solar cells, and a backsheet on the backsides of the solar cells. The solar cell module includes an electrical insulator between the transparent cover and the front sides of the solar cells. An encapsulant protectively packages the solar cells. To prevent polarization, the insulator has resistance suitable to prevent charge from leaking from the front sides of the solar cells to other portions of the solar cell module by way of the transparent cover. The insulator may be attached (e.g., by coating) directly on an underside of the transparent cover or be a separate layer formed between layers of the encapsulant. The solar cells may be back junction solar cells.

Abstract: In the manufacture of a wafer-type silicon solar cell having on its front side a silicon nitride AR coating and an electrical contact that is formed by printing a thick film metal ink onto the silicon nitride in the form of a grid-like pattern having narrow fingers and then firing that ink to convert it to a bonded metal contact, a surface treatment method is provided to adjust the condition of the surface of the silicon nitride coating in a manner that substantially improves the adherence of the thick film ink to the silicon nitride coating, thereby eliminating or substantially inhibiting the tendency of the narrow fingers of the unfired ink to peel away before the ink has been fired to produce the electrical contact. The surface treatment method comprises subjecting the silicon nitride layer to a corona discharge using a plasma jet and is readily incorporated into the manufacturing process sequence without requiring any modification of existing stages of that sequence.

Abstract: In the manufacture of a wafer-type silicon solar cell having on its front side a silicon nitride AR coating and an electrical contact that is formed by printing a thick film metal ink onto the silicon nitride in the form of a grid-like pattern having narrow fingers and then firing that ink to convert it to a bonded metal contact, a surface treatment method is provided to adjust the condition of the surface of the silicon nitride coating in a manner that substantially improves the adherence of the thick film ink to the silicon nitride coating, thereby eliminating or substantially inhibiting the tendency of the narrow fingers of the unfired ink to peel away before the ink has been fired to produce the electrical contact. The surface treatment method comprises subjecting the silicon nitride layer to a corona discharge using a plasma jet and is readily incorporated into the manufacturing process sequence without requiring any modification of existing stages of that sequence.