Abstract: Aspects described herein relate to display of data elements of high-volume, high-speed data on limited display screens. The method comprises acquiring information associated with a plurality of option products for a specific underlying asset, the information including, for each option product, information on an expiration date and information on a strike price for the specific underlying asset on the expiration date, generating a first chart in which the information associated with the plurality of option products is mapped, and outputting the generated first chart as at least part of a user interface, wherein a first axis of the first chart represents time information on the expiration dates of the plurality of option products, and a second axis of the first chart represents information on the strike prices of the specific underlying asset associated with the plurality of option products.

Abstract: The present disclosure relates to a method for supporting analysis, display, and/or interaction with complex real-time data items, particularly in view of the limited display functionality of some computing devices. The method comprises: acquiring information on a first chart associated with a specific data item, the information on the first chart comprising information associated with a real-time data for the specific data item; generating, based on the information on the first chart, the first chart that comprises at least one of value-fluctuation information of the specific data item for a current time and a period before the current time, or information associated with the real-time data for a period after the current time, and outputting the first chart as at least part of a user interface.

Abstract: A method includes: storing a patent and a file history of the patent in a data storage, collecting, labeling, and storing documentation relating to the patent in the data storage, for each chunk of the documentation, storing a vector embedding and a related chunk in a vector data structure, generating, with a language model, a version of claim constructions of the patent and a summary of the patent using the patent and the file history, creating a vector embedding for each limitation of the version of the claim constructions, identifying the vector embeddings stored in the vector data structure having the closest matches, retrieving, from the vector data structure, the chunks of documentation associated with the vector embeddings having the closest matches, and generating a claim chart using the language model based on the version of the claim constructions and the chunks of documentation associated with the closet matches.

Abstract: A ball grid array package comprises a substrate having a first surface and a second surface, a chip, an insulating material, and a solder ball. The surface of the substrate comprises ball pads, conducting traces, and solder masks wherein the conducting traces are disposed in between the adjacent ball pads, and are covered by the solder mask, in addition, a portion of each of the ball pads is also covered by the solder mask. The solder mask includes an opening positioned in the area corresponding to the ball pads wherein the opening exposes a portion of the surface the ball pad and a portion of the side wall of the ball pad. The chip is disposed on the second surface of the substrate, and is sealed and encapsulated by the insulated material. The solder balls are disposed on the first surface of the substrate, and are positioned at the openings of the ball pads.

Abstract: A ball grid array package comprises a substrate having a first surface and a second surface, a chip, an insulating material, and a solder ball. The surface of the substrate comprises ball pads, conducting traces, and solder masks wherein the conducting traces are disposed in between the adjacent ball pads, and are covered by the solder mask, in addition, a portion of each of the ball pads is also covered by the solder mask. The solder mask includes an opening positioned in the area corresponding to the ball pads wherein the opening exposes a portion of the surface the ball pad and a portion of the side wall of the ball pad. The chip is disposed on the second surface of the substrate, and is sealed and encapsulated by the insulated material. The solder balls are disposed on the first surface of the substrate, and are positioned at the openings of the ball pads.

Abstract: The present disclosure pertains to a post-etch treatment which is performed after a dielectric etch process. Using the method of the invention, byproducts formed on the sidewalls of contact vias during the dielectric etch process can be removed efficiently. The method of the invention also reduces or eliminates the problem of polymer accumulation on process chamber surfaces. Typically, after the etch of a dielectric material to define pattern or interconnect filling spaces, a series of post-etch treatment steps is performed to remove residues remaining on the wafer after the dielectric etch process. According to the method of the present invention, a post-etch treatment method including one or more steps is performed after the dielectric etch process, preferably within the same processing chamber in which the dielectric etch process was performed.

Abstract: A ball grid array package comprises a substrate having a first surface and a second surface, a chip, an insulating material, and a solder ball. The surface of the substrate comprises ball pads, conducting traces, and solder masks wherein the conducting traces are disposed in between the adjacent ball pads, and are covered by the solder mask, in addition, a portion of each of the ball pads is also covered by the solder mask. The solder mask includes an opening positioned in the area corresponding to the ball pads wherein the opening exposes a portion of the surface the ball pad and a portion of the side wall of the ball pad. The chip is disposed on the second surface of the substrate, and is sealed and encapsulated by the insulated material. The solder balls are disposed on the first surface of the substrate, and are positioned at the openings of the ball pads.