Abstract: The present invention is directed to functional nanofibers, methods of making the functional nanofibers, and products such as filters and membranes comprising mats of the functional nanofibers.

Abstract: The present invention is directed to methods of sequestering carbon dioxide using metal oxide compositions, methods of making the metal oxide compositions, and articles comprising the metal oxide compositions.

Abstract: Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Abstract: The present invention is directed to heterogeneous stamp and stencil compositions, methods for patterning substrates using contact printing processes employing the heterogeneous stamps and stencils, and products formed by the contact printing processes.

Abstract: Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract: The present invention is an electronic device and a process for making the electronic device in which the semiconductor component comprises at least one carbon nanotube functionalized with a fluorinated olefin. Functionalization with the fluorinated olefin renders the carbon nanotube semiconducting.

Abstract: The invention provides a method to form a pattern of functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. Contact of an adhesive material to an exterior surface opposite the substrate and separation of the adhesive from the substrate forms the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.

Abstract: The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

Abstract: The invention is related to thermal imageable dielectric layers and thermal transfer donors and receivers comprising dielectric layers. The thermal transfer donors are useful in making electronic devices by thermal transfer of dielectric layers having excellent resistivity, good transfer properties and good adhesion to a variety of receivers.

Abstract: Provided are processes for enhancing the resolution of a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.

Abstract: The present invention relates a printing element comprising at least one polymer layer which has photoimageable constituents and additions to make the polymer layer either hydrophobic or hydrophilic. The printing element may have two polymer layers on a substrate in which one of the layers comprises fluorinated acrylates or methacrylates.

Abstract: The present invention is a transistor and a process for making the transistor in which the semiconductor component comprises at least one carbon nanotube functionalized by cycloaddition with a fluorinated olefin. Functionalization with the fluorinated olefin renders the carbon nanotube semiconducting.

Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract: The invention pertains to a printing form precursor and a method for preparing a stamp from the precursor for use in soft lithographic applications. The printing form precursor includes a composition layer of a fluorinated compound capable of polymerization upon exposure to actinic radiation and a flexible support transparent to the actinic radiation adjacent the composition layer.

Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract: The invention is a method for forming a thin layer of particulate on a substrate by applying a layer of a composition comprising the particulate and a dispersing agent on the substrate, treating the layer with charged gas to remove the dispersing agent from the layer; and induction heating to form operative connection of the particulate.

Abstract: The invention is a method for forming a thin layer of particulate on a substrate by applying a layer of a composition comprising the particulate and a dispersing agent on the substrate, treating the layer with charged gas to remove the dispersing agent from the layer; and induction heating to form operative connection of the particulate.

Abstract: The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

Abstract: The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

Abstract: The invention provides a method to form a pattern of functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. Contact of an adhesive material to an exterior surface opposite the substrate and separation of the adhesive from the substrate forms the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.