Abstract: A self-contained means to move a media or component, such as fiber (12) or other miniature object, such as a lens, into a desired position is given. The fiber (12) or component is moved in various dimensions to achieve the desired location and is locked into position after the move. An input electrical signal, such as a voltage or current controls movement. A thermal actuator comprises the micro-positioner (80) using semiconductor technology in one embodiment. In another embodiment, of the present invention, a thermal or electrostatic actuator uses mechanical gears to move the fiber. Another embodiment of the present invention is implemented using mechanical technology such as microelectromechanical system (MEMS) technology. Another embodiment of the present invention, utilizes piezoelectric materials to facilitate fiber movement.

Abstract: A self-contained means to move a media or component, such as fiber (12) or other miniature object, such as a lens, into a desired position is given. The fiber (12) or component is moved in various dimensions to achieve the desired location and is locked into position after the move. An input electrical signal, such as a voltage or current controls movement. A thermal actuator comprises the micro-positioner (80) using semiconductor technology in one embodiment. In another embodiment, of the present invention, a thermal or electrostatic actuator uses mechanical gears to move the fiber. Another embodiment of the present invention is implemented using mechanical technology such as microelectromechanical system (MEMS) technology. Another embodiment of the present invention, utilizes piezoelectric materials to facilitate fiber movement.

Abstract: A self-contained means to move a media or component, such as fiber (12) or other miniature object, such as a lens, into a desired position is given. The fiber (12) or component is moved in various dimensions to achieve the desired location and is locked into position after the move. An input electrical signal, such as a voltage or current controls movement. A thermal actuator comprises the micro-positioner (80) using semiconductor technology in one embodiment. In another embodiment, of the present invention, a thermal or electrostatic actuator uses mechanical gears to move the fiber. Another embodiment of the present invention is implemented using mechanical technology such as microelectromechanical system (MEMS) technology. Another embodiment of the present invention, utilizes piezoelectric materials to facilitate fiber movement.

Abstract: A self-contained means to move a media or component, such as fiber (12) or other miniature object, such as a lens, into a desired position is given. The fiber (12) or component is moved in various dimensions to achieve the desired location and is locked into position after the move. An input electrical signal, such as a voltage or current controls movement. A thermal actuator comprises the micro-positioner (80) using semiconductor technology in one embodiment. In another embodiment, of the present invention, a thermal or electrostatic actuator uses mechanical gears to move the fiber. Another embodiment of the present invention is implemented using mechanical technology such as microelectromechanical system (MEMS) technology. Another embodiment of the present invention, utilizes piezoelectric materials to facilitate fiber movement.

Abstract: Photocapacitive detectors with varying bandgap Hg.sub.1-x Cd.sub.x Te (604) for two color detection and one color detection with increased potential well capacity. Preferred embodiments include a transparent insulated gate (608) on a top layer (632) of Hg.sub.0.8 Cd.sub.0.2 Te over a lower layer (634) of Hg.sub.0.83 Cd.sub.0.27 Te for detection of two infrared colors by varying gate potential to either confine the potential well to the top layer or to extend the potential well to both layers. Also, methods of compositionally grading the Hg.sub.1-x Cd.sub.x Te by fluid transport plus diffusion.

Abstract: A disk shaped ceramic support has a mounting surface provided as a unitary part of the support with conductors extending generally outward from the mounting surface through the thickness dimension of the support, the outer ends of the conductive leads being connected to a ring of terminal leads. A charge coupled device (CCD) imager chip is secured to the mounting surface to leave a backside illumination surface of the chip unobstructed and electrical interconnections are made from terminal pads on the front surface of the chip to the ends of the conductive leads adjacent the mounting surface. A cover plate attached to the insulating support outwardly of the interconnections encloses the front surface of the chip. In a preferred structure the chip is mounted on an apertured molybdenum disk unitarily attached to the support with the illumination surface of the CCD chip facing the aperture.