Patents by Inventor Graeme Bunce

Graeme Bunce has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220346198
    Abstract: A food processing machine for processing a food product includes a processing module having a housing with a sidewall, opposing end walls, and a chamber between the end walls and a conveyor extending through the end walls and the chamber and configured to convey the food product through the chamber. A microwave generating device is coupled to the sidewall and configured to generate microwave energy. A waveguide assembly is configured to receive the microwave energy, direct the microwave energy along a waveguide axis, and subsequently direct the microwave energy in a transverse direction that is transverse to the vertical direction through the sidewall and into the chamber such that the microwave energy heats the food products.
    Type: Application
    Filed: October 27, 2021
    Publication date: October 27, 2022
    Applicant: Alkar-RapidPak, Inc.
    Inventors: Stephen Michael King, Thomas John Hansel, Graeme Bunce, Thomas Paulson, Thomas Victor Sonntag, Craig R. Bonneville, Easten Lovelace, Shane Patrick Grady, Paul Christopher Buschkopf, Dalton Brian McGinness
  • Patent number: 10680335
    Abstract: A three-dimensional resonant chamber is described. The three-dimensional resonant chamber may support a plurality of circularly polarized modes at a desired frequency. The desired frequency may be in an ISM (Industrial, Scientific, Medical) frequency band, such as in the 902 MHz-928 MHz or in the 2.4 GHz-2.5 GHz. The three-dimensional resonant chamber may include one or more openings for coupling electromagnetic radiation outside the three-dimensional resonant chamber. The three-dimensional resonant chamber may be disposed in a cavity, such as a microwave oven, and may be configured to excite the cavity through the one or more openings. The three-dimensional resonant chamber may be connected to a waveguide support a circularly polarized mode.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: June 9, 2020
    Assignee: Ferrite Microwave Technologies LLC
    Inventors: Graeme Bunce, Peter H. Tibbetts
  • Publication number: 20180123247
    Abstract: A three-dimensional resonant chamber is described. The three-dimensional resonant chamber may support a plurality of circularly polarized modes at a desired frequency. The desired frequency may be in an ISM (Industrial, Scientific, Medical) frequency band, such as in the 902 MHz-928 MHz or in the 2.4 GHz-2.5 GHz. The three-dimensional resonant chamber may comprise one or more openings for coupling electromagnetic radiation outside the three-dimensional resonant chamber. The three-dimensional resonant chamber may be disposed in a cavity, such as a microwave oven, and may be configured to excite the cavity through the one or more openings. The three-dimensional resonant chamber may be connected to a waveguide support a circularly polarized mode.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 3, 2018
    Inventors: Graeme Bunce, Peter H. Tibbetts
  • Publication number: 20120272815
    Abstract: Various improvements and configurations for magnetic musical instrument pickups. Many of the embodiments discussed herein include printed circuit board (pcb) coils, but other embodiments may involve conventional wire wound coils. In some embodiments, the coils (pcb and/or wire wound) are encased in rigid encasement material (see DEFINITIONS section) to reduce microphony and make a quieter pickup. Also, the use of pcb coils allows for many and various new coil shapes and/or configurations because the footprint and stacking of pcb traces are relatively easy to control and/or change. Also disclosed are electromagnetic field interference reduction techniques and integration of multiple coils directly into a single pcb substrate and/or scratchpate. Also disclosed is the use of Hallbach biasing magnet arrays in connection with wire wound and/or pcb coils.
    Type: Application
    Filed: June 14, 2012
    Publication date: November 1, 2012
    Applicant: ANAREN, INC.
    Inventors: Thomas Lingel, Graeme Bunce, Mark Bowyer
  • Patent number: 8183952
    Abstract: The present invention is directed to a surface mountable circulator/isolator device that includes a first dielectric layer having an electric circuit formed thereon. A second center dielectric layer is disposed adjacent the first dielectric layer, the center dielectric layer including an opening formed therein, the opening being aligned relative to the electric circuit. A ferrite element is disposed in the opening such that the ferrite abuts the electric circuit and is aligned in two-dimensions relative to the electric circuit. A third dielectric layer is disposed adjacent the second center layer. The third dielectric layer includes a ground plane formed on each major surface thereof. The first dielectric layer, the second center dielectric layer, the ferrite element, and the third dielectric layer are bonded together to form a laminated multi-layer structure. A permanent magnet is bonded to the second ground plane.
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: May 22, 2012
    Assignee: Anaren, Inc.
    Inventors: Graeme Bunce, Thomas Lingel
  • Publication number: 20100259336
    Abstract: The present invention is directed to a surface mountable circulator/isolator device that includes a first dielectric layer having an electric circuit formed thereon. A second center dielectric layer is disposed adjacent the first dielectric layer, the center dielectric layer including an opening formed therein, the opening being aligned relative to the electric circuit. A ferrite element is disposed in the opening such that the ferrite abuts the electric circuit and is aligned in two-dimensions relative to the electric circuit. A third dielectric layer is disposed adjacent the second center layer. The third dielectric layer includes a ground plane formed on each major surface thereof. The first dielectric layer, the second center dielectric layer, the ferrite element, and the third dielectric layer are bonded together to form a laminated multi-layer structure. A permanent magnet is bonded to the second ground plane.
    Type: Application
    Filed: April 14, 2010
    Publication date: October 14, 2010
    Applicant: ANAREN, INC.
    Inventors: Graeme Bunce, Thomas Lingel