Abstract: An inkjet nozzle device includes a main chamber having a floor, a roof and a perimeter wall enclosing the main chamber. The main chamber includes: a firing chamber having a nozzle aperture defined in the roof and a bar heater for ejection of ink through the nozzle aperture; an antechamber for supplying ink to the firing chamber, the antechamber having a chamber inlet defined in the floor; and a baffle plate extending parallel with the bar heater, which partitions the main chamber to define the firing chamber and the antechamber. The nozzle device has mirror symmetry about a symmetry plane extending perpendicular to the longitudinal axes of the bar heater and the baffle plate.

Abstract: An inkjet nozzle device includes a main chamber having a floor, a roof and a perimeter wall extending between the floor and the roof. The main chamber includes: a firing chamber having a nozzle aperture defined in the roof and a bar heater for ejection of ink through the nozzle aperture; an antechamber for supplying ink to the firing chamber, the antechamber having a chamber inlet defined in the floor; and a baffle plate extending parallel with the bar heater, which partitions the main chamber to define the firing chamber and the antechamber. The nozzle device has mirror symmetry about a symmetry plane extending perpendicular to the longitudinal axes of the bar heater and the baffle plate.

Abstract: A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.

Abstract: An inkjet printing system includes: (a) an inkjet printhead having a rigid elongate manifold with first and second parallel ink supply channels extending along a length of the manifold between respective ink ports positioned at opposite ends thereof; and a plurality of printhead chips mounted to a lower surface of the manifold, the ink supply channels supplying ink to the printhead chips via ink outlets defined in the lower surface. One end of the manifold has a first ink inlet port for the first ink supply channel and an ink outlet port for the second ink supply channel. The other end of the manifold has a first ink outlet port for the first ink supply channel and a second ink inlet port for the second ink supply channel. An ink delivery system is configured to flow ink along the first and second channels in opposite directions.

Abstract: An inkjet nozzle device includes a main chamber having a floor, a roof and a perimeter wall extending between the floor and the roof. The main chamber includes: a firing chamber having a nozzle aperture defined in the roof and a bar heater for ejection of ink through the nozzle aperture; an antechamber for supplying ink to the firing chamber, the antechamber having a chamber inlet defined in the floor; and a baffle plate extending parallel with the bar heater, which partitions the main chamber to define the firing chamber and the antechamber.

Abstract: An inkjet printing system includes: (a) an inkjet printhead having a rigid elongate manifold with first and second parallel ink supply channels extending along a length of the manifold between respective ink ports positioned at opposite ends thereof; and a plurality of printhead chips mounted to a lower surface of the manifold, the ink supply channels supplying ink to the printhead chips via ink outlets defined in the lower surface. One end of the manifold has a first ink inlet port for the first ink supply channel and an ink outlet port for the second ink supply channel. The other end of the manifold has a first ink outlet port for the first ink supply channel and a second ink inlet port for the second ink supply channel. An ink delivery system is configured to flow ink along the first and second channels in opposite directions.

Abstract: A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.

Abstract: A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.

Abstract: An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.

Abstract: A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.

Abstract: An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.