Patents by Inventor Graeme Maxwell

Graeme Maxwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220406522
    Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.
    Type: Application
    Filed: August 29, 2022
    Publication date: December 22, 2022
    Inventors: David P. Cappabianca, Joseph T. DiBene, II, Shawn Searles, Le Wang, Yizhang Yang, Sean Cian O'Mathuna, Santosh Kulkarni, Paul McCloskey, Zoran Pavlovic, William Lawton, Graeme Maxwell, Joseph O'Brien, Hugh Charles Smiddy
  • Patent number: 11430606
    Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: August 30, 2022
    Assignee: Apple Inc.
    Inventors: David P. Cappabianca, Joseph T. DiBene, II, Shawn Searles, Le Wang, Yizhang Yang, Sean Cian O'Mathuna, Santosh Kulkarni, Paul McCloskey, Zoran Pavlovic, William Lawton, Graeme Maxwell, Joseph O'Brien, Hugh Charles Smiddy
  • Publication number: 20190221365
    Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.
    Type: Application
    Filed: August 24, 2017
    Publication date: July 18, 2019
    Inventors: David P. Cappabianca, Joseph T. DiBene, II, Shawn Searles, Le Wang, Yizhang Yang, Sean Cian O'Mathuna, Santosh Kulkarni, Paul McCloskey, Zoran Pavlovic, William Lawton, Graeme Maxwell, Joseph O'Brien, Hugh Charles Smiddy
  • Patent number: 8548292
    Abstract: The present invention provides an assembly (1) of integrated optical components and methods of producing thereof wherein the assembly (1) of optically linked optical components comprises a motherboard (2) having one or more primary lateral reference features (28) and a sub-assembly (20) comprising an optical component (22) mounted on a daughterboard (24), said sub-assembly (20) having one or more secondary lateral reference features (30). The primary lateral reference features may be optical alignment features. The daughterboard (24) may be mounted on the motherboard (2) such that the optical component (22) may extend into a motherboard recess (18). The lateral alignment of the component (22) with the motherboard (2) is provided by aligning the primary (28) and secondary lateral reference features (30). The daughterboard (24) may further comprise tertiary lateral reference features (42) which in combination with the secondary lateral reference features 30 form a self correcting alignment system.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: October 1, 2013
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: David Rogers, Graeme Maxwell, Sebastien Lardenois
  • Publication number: 20110164849
    Abstract: The present invention provides an assembly (1) of integrated optical components and methods of producing thereof wherein the assembly (1) of optically linked optical components comprises a motherboard (2) having one or more primary lateral reference features (28) and a sub-assembly (20) comprising an optical component (22) mounted on a daughterboard (24), said sub-assembly (20) having one or more secondary lateral reference features (30). The primary lateral reference features may be optical alignment features. The daughterboard (24) may be mounted on the motherboard (2) such that the optical component (22) may extend into a motherboard recess (18). The lateral alignment of the component (22) with the motherboard (2) is provided by aligning the primary (28) and secondary lateral reference features (30). The daughterboard (24) may further comprise tertiary lateral reference features (42) which in combination with the secondary lateral reference features 30 form a self correcting alignment system.
    Type: Application
    Filed: July 27, 2009
    Publication date: July 7, 2011
    Inventors: David Rogers, Graeme Maxwell, Sebastien Lardenois