Patents by Inventor Graeme Wyborn

Graeme Wyborn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6180520
    Abstract: The present invention relates to an interconnect structure wherein the upper surface of the first interconnect level is a tungsten layer, portions of the first interconnect level are insulated from one another by an insulator of the SOG type, portions of a second interconnect level are connected to portions of the first interconnect level by conductive pads formed in openings of an insulating layer, at least the lower part of which is of the SOG type, the walls and the bottom of the openings are covered with a thin titanium layer, and the openings are filled with a conductive material selected in the group including Al, Cu and aluminum alloys such as silicon, copper, and titanium alloys.
    Type: Grant
    Filed: April 8, 1997
    Date of Patent: January 30, 2001
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventors: Michel Marty, G{acute over (e)}rard Passemard, Graeme Wyborn