Patents by Inventor Graham M. Bates
Graham M. Bates has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9708508Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: GrantFiled: June 8, 2015Date of Patent: July 18, 2017Assignee: GLOBALFOUNDRIES Inc.Inventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
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Patent number: 9348057Abstract: A calibration gauge, an apparatus and a method for calibrating sensors that detect wafer protrusion from a wafer cassette using the calibration gauge. The calibration gauge includes a disk having a first region which is a circular sector of central angle A1 having a constant radius R1 about a center and an integral second region of increasing radius about the center, the increasing radius increasing from R1 to R2 through a central angle A2, wherein R2 is greater than R1 and A1+A2 equals 360°.Type: GrantFiled: July 24, 2014Date of Patent: May 24, 2016Assignee: International Business Machines CorporationInventors: John J. Bandy, Graham M. Bates, Bradley M. Mahan
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Publication number: 20160025893Abstract: A calibration gauge, an apparatus and a method for calibrating sensors that detect wafer protrusion from a wafer cassette using the calibration gauge. The calibration gauge includes a disk having a first region which is a circular sector of central angle A1 having a constant radius R1 about a center and an integral second region of increasing radius about the center, the increasing radius increasing from R1 to R2 through a central angle A2, wherein R2 is greater than R1 and A1+A2 equals 360°.Type: ApplicationFiled: July 24, 2014Publication date: January 28, 2016Inventors: John J. Bandy, Graham M. Bates, Bradley M. Mahan
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Patent number: 9221241Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.Type: GrantFiled: February 27, 2014Date of Patent: December 29, 2015Assignee: GLOBALFOUNDRIES INC.Inventors: John J. Bandy, Graham M. Bates, Jeffery A. Brigante
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Publication number: 20150267084Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: ApplicationFiled: June 8, 2015Publication date: September 24, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
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Patent number: 9057004Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: GrantFiled: September 23, 2011Date of Patent: June 16, 2015Assignee: International Business Machines CorporationInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
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Publication number: 20140174670Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.Type: ApplicationFiled: February 27, 2014Publication date: June 26, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John J. Bandy, Graham M. Bates, Jeffery A. Brigante
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Patent number: 8734665Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol, a controlled amount of chloride ion source and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: GrantFiled: October 12, 2011Date of Patent: May 27, 2014Assignee: International Business Machines CorporationInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Eva A. Shah, Matthew T. Tiersch, Eric J. White
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Patent number: 8715460Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.Type: GrantFiled: January 10, 2012Date of Patent: May 6, 2014Assignee: International Business Machines CorporationInventors: John J. Bandy, Graham M. Bates, Jeffery A. Brigante
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Patent number: 8637403Abstract: A method of manufacturing a semiconductor structure includes varying local chemical mechanical polishing (CMP) abrading rates of an insulator film by selectively varying a carbon content of the insulator film.Type: GrantFiled: December 12, 2011Date of Patent: January 28, 2014Assignee: International Business Machines CorporationInventors: Yoba Amoah, Graham M. Bates, Joseph P. Hasselbach, Thomas L. McDevitt, Eva A. Shah
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Publication number: 20130174987Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.Type: ApplicationFiled: January 10, 2012Publication date: July 11, 2013Applicant: International Business Machines CorporationInventors: John J. Bandy, Graham M. Bates, Jeffery A. Brigante
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Publication number: 20130147067Abstract: A method of manufacturing a semiconductor structure includes varying local chemical mechanical polishing (CMP) abrading rates of an insulator film by selectively varying a carbon content of the insulator film.Type: ApplicationFiled: December 12, 2011Publication date: June 13, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Yoba AMOAH, Graham M. BATES, Jospeh P. HASSELBACH, Thomas L. MCDEVITT, Eva A. SHAH
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Publication number: 20130092651Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol, a controlled amount of chloride ion source and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: ApplicationFiled: October 12, 2011Publication date: April 18, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Eva A. Shah, Matthew T. Tiersch, Eric J. White
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Publication number: 20130078811Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: ApplicationFiled: September 23, 2011Publication date: March 28, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
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Patent number: 8210904Abstract: A patterned portion of a patterned semiconductor substrate is removed by abrasive mechanical planarization employing an abrasive pad but without employing any slurry. Preferably, water is supplied to enhance the removal rate during the mechanical planarization. The removal rate of material is substantially independent for common materials employed in back-end-of-line (BEOL) semiconductor materials, which enables non-selective removal of the material containing metallization structures. The removal rate of silicon is lower than the removal rate for the BEOL semiconductor materials, enabling a self-stopping planarization process.Type: GrantFiled: April 29, 2008Date of Patent: July 3, 2012Assignee: International Business Machines CorporationInventors: Graham M. Bates, David Domina, James L. Hardy, Jr., Eric J. White
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Patent number: 8088690Abstract: The instant invention is a method of polishing a substrate including contacting a substrate having at least one metal layer including copper with a chemical-mechanical polishing composition. The CMP composition includes an abrasive, a surfactant, an oxidizer, an organic acid including polyacrylic acid or polymethacrylic acid, a corrosion inhibitor, and a liquid carrier. A portion of the copper in the metal layer is abraded to polish the substrate. A second CMP composition contacts the abraded substrate, the second acrylate free composition including an abrasive, a surfactant, an oxidizer, and a corrosion inhibitor, and a liquid carrier. Any dendrites that may have formed on the substrate are removed through abrasion.Type: GrantFiled: March 31, 2009Date of Patent: January 3, 2012Assignee: International Business Machines CorporationInventors: Thomas L. McDevitt, Graham M. Bates, Eva A. Shah, Matthew T. Tiersch, Eric J. White
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Publication number: 20100248479Abstract: The instant invention is a method of polishing a substrate including contacting a substrate having at least one metal layer including copper with a chemical-mechanical polishing composition. The CMP composition includes an abrasive, a surfactant, an oxidizer, an organic acid including polyacrylic acid or polymethacrylic acid, a corrosion inhibitor, and a liquid carrier. A portion of the copper in the metal layer is abraded to polish the substrate. A second CMP composition contacts the abraded substrate, the second acrylate free composition including an abrasive, a surfactant, an oxidizer, and a corrosion inhibitor, and a liquid carrier. Any dendrites that may have formed on the substrate are removed through abrasion.Type: ApplicationFiled: March 31, 2009Publication date: September 30, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas L. McDevitt, Graham M. Bates, Eva A. Shah, Matthew T. Tiersch, Eric J. White
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Publication number: 20090270017Abstract: A patterned portion of a patterned semiconductor substrate is removed by abrasive mechanical planarization employing an abrasive pad but without employing any slurry. Preferably, water is supplied to enhance the removal rate during the mechanical planarization. The removal rate of material is substantially independent for common materials employed in back-end-of-line (BEOL) semiconductor materials, which enables non-selective removal of the material containing metallization structures. The removal rate of silicon is lower than the removal rate for the BEOL semiconductor materials, enabling a self-stopping planarization process.Type: ApplicationFiled: April 29, 2008Publication date: October 29, 2009Applicant: International Business Machines CorporationInventors: Graham M. Bates, David Domina, James L. Hardy, JR., Eric J. White