Abstract: An integrated circuit (IC) device for driving a light emitting device, such as a laser diode, includes a heat-absorbing structure fabricated on a substrate over an electrical component, such as an output transistor, to reduce the heat transfer between the electrical component and the light emitting device. The heat-absorbing structure is designed to absorb some of the heat generated by the electrical component so that less heat from the electrical component is transferred to the light emitting device, which reduces the operating temperature of the light emitting device. A method of fabricating the IC device includes forming the electrical component on the substrate and forming the heat-absorbing structure on the substrate over the electrical component. The heat-absorbing structure may be configured to substantially encase the electrical component.

Abstract: An optical detector and method for detecting incident light utilizes a pair of photosensitive devices in which one of the photosensitive devices is selectively exposed to the incident light to generate differential current signals that can be used to measure the intensity of the incident light. The photosensitive devices may be phototransistors having a silicon-germanium (SiGe) absorption region that is able to convert longer wavelength light, such as 980 nm or 1300 nm light, into current. The SiGe phototransistors may be fabricated on a silicon substrate.

Abstract: An integrated circuit (IC) device for driving a light emitting device, such as a laser diode, includes a heat-absorbing structure fabricated on a substrate over an electrical component, such as an output transistor, to reduce the heat transfer between the electrical component and the light emitting device. The heat-absorbing structure is designed to absorb some of the heat generated by the electrical component so that less heat from the electrical component is transferred to the light emitting device, which reduces the operating temperature of the light emitting device. A method of fabricating the IC device includes forming the electrical component on the substrate and forming the heat-absorbing structure on the substrate over the electrical component. The heat-absorbing structure may be configured to substantially encase the electrical component.

Abstract: An optical detector and method for detecting incident light utilizes a pair of photosensitive devices in which one of the photosensitive devices is selectively exposed to the incident light to generate differential current signals that can be used to measure the intensity of the incident light. The photosensitive devices may be phototransistors having a silicon-germanium (SiGe) absorption region that is able to convert longer wavelength light, such as 980 nm or 1300 nm light, into current. The SiGe phototransistors may be fabricated on a silicon substrate.