Patents by Inventor Grama Ramaswamy BHASHYAM

Grama Ramaswamy BHASHYAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR SIMULATING PRINTED CIRCUIT BOARD COMPONENTS
    Publication number: 20240086591
    Abstract: Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 14, 2024
    Inventors: Wenjie XIE, Jin WANG, Grama Ramaswamy BHASHYAM, Tim Paul PAWLAK
  • Systems and methods for simulating printed circuit board components
    Patent number: 11797731
    Abstract: Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: October 24, 2023
    Assignee: ANSYS, INC.
    Inventors: Wenjie Xie, Jin Wang, Grama Ramaswamy Bhashyam, Tim Paul Pawlak
  • SYSTEMS AND METHODS FOR SIMULATING PRINTED CIRCUIT BOARD COMPONENTS
    Publication number: 20210209272
    Abstract: Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.
    Type: Application
    Filed: September 11, 2020
    Publication date: July 8, 2021
    Inventors: Wenjie XIE, Jin WANG, Grama Ramaswamy BHASHYAM, Tim Paul PAWLAK